
AMD Xilinx
XC7Z035-2FFG676I
XC7Z035-2FFG676I ECAD Model
XC7Z035-2FFG676I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 1 V | |
uPs/uCs/Peripheral ICs Type | SYSTEM ON CHIP | |
Technology | CMOS | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B676 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA676,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Seated Height-Max | 3.24 mm | |
Width | 27 mm | |
Length | 27 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC7Z035-2FFG676I Datasheet Download
XC7Z035-2FFG676I Overview
The XC7Z035-2FFG676I chip model is a powerful and versatile tool for a variety of applications. It is designed with high-performance digital signal processing, embedded processing, and image processing in mind, and is programmed using the HDL language. With its extensive feature set, the XC7Z035-2FFG676I is capable of handling a wide range of tasks.
The original design intention of the XC7Z035-2FFG676I was to provide a powerful and reliable solution for a variety of applications. Its capabilities are such that it can be used in a variety of scenarios, from high-performance digital signal processing to embedded processing and image processing. The chip model is capable of being used in advanced communication systems, as well as in networks and intelligent scenarios.
The XC7Z035-2FFG676I is also designed with future upgrades in mind. It can be upgraded to handle more complex tasks, and its capabilities can be expanded to meet the needs of more advanced applications. With its ability to be used in the era of fully intelligent systems, the XC7Z035-2FFG676I is a powerful and reliable tool for a variety of applications.
The XC7Z035-2FFG676I chip model is a powerful and versatile tool for a variety of applications. It is designed with high-performance digital signal processing, embedded processing, and image processing in mind, and is programmed using the HDL language. With its extensive feature set, the XC7Z035-2FFG676I is capable of handling a wide range of tasks. Its original design intention was to provide a powerful and reliable solution for a variety of applications. Its capabilities are such that it can be used in a variety of scenarios, from high-performance digital signal processing to embedded processing and image processing. It can also be used in advanced communication systems, as well as in networks and intelligent scenarios.
The XC7Z035-2FFG676I is designed with future upgrades in mind. It can be upgraded to handle more complex tasks, and its capabilities can be expanded to meet the needs of more advanced applications. With its ability to be used in the era of fully intelligent systems, the XC7Z035-2FFG676I is a powerful and reliable tool for a variety of applications. It can be used in a variety of intelligent scenarios, such as autonomous driving, robotics, and machine learning. It can also be used in networks for high-speed data transmission and communication.
The XC7Z035-2FFG676I chip model is a powerful and versatile tool for a variety of applications. It is designed with high-performance digital signal processing, embedded processing, and image processing in mind, and is programmed using the HDL language. With its extensive feature set, the XC7Z035-2FFG676I is capable of handling a wide range of tasks. Its original design intention was to provide a powerful and reliable solution for a variety of applications. It can be used in a variety of intelligent scenarios, such as autonomous driving, robotics, and machine learning. It can also be used in networks for high-speed data transmission and communication. Its capabilities are such that it can be used in a variety of scenarios, from high-performance digital signal processing to embedded processing and image processing. It can also be used in advanced communication systems, as well as in networks and intelligent scenarios. Furthermore, it is designed with future upgrades in mind, allowing it to be used in the era of fully intelligent systems.
The XC7Z035-2FFG676I chip model is a powerful and versatile tool for a variety of applications. With its extensive feature set, it is capable of handling a wide range of tasks. It is designed with high-performance digital signal processing, embedded processing, and image processing in mind, and is programmed using the HDL language. It can be used in a variety of intelligent scenarios, such as autonomous driving, robotics, and machine learning. It can also be used in networks for high-speed data transmission and communication. It is also designed with future upgrades in mind, allowing it to be used in the era of fully intelligent systems. In short, the XC7Z035-2FFG676I is a powerful and reliable tool for a variety of applications, offering a wide range of capabilities and possibilities for the future.
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3,177 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $99.0715 | $99.0715 |
10+ | $98.0062 | $980.0622 |
100+ | $92.6798 | $9,267.9795 |
1000+ | $87.3534 | $43,676.6850 |
10000+ | $79.8964 | $79,896.3750 |
The price is for reference only, please refer to the actual quotation! |