XC7Z035-2FFG676I
XC7Z035-2FFG676I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC7Z035-2FFG676I


XC7Z035-2FFG676I
F20-XC7Z035-2FFG676I
Active
CMOS, BGA
BGA

XC7Z035-2FFG676I ECAD Model


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XC7Z035-2FFG676I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 1 V
uPs/uCs/Peripheral ICs Type SYSTEM ON CHIP
Technology CMOS
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B676
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Seated Height-Max 3.24 mm
Width 27 mm
Length 27 mm
Ihs Manufacturer XILINX INC
Package Description BGA,
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC7Z035-2FFG676I Datasheet Download


XC7Z035-2FFG676I Overview



The XC7Z035-2FFG676I chip model is a powerful and versatile tool for a variety of applications. It is designed with high-performance digital signal processing, embedded processing, and image processing in mind, and is programmed using the HDL language. With its extensive feature set, the XC7Z035-2FFG676I is capable of handling a wide range of tasks.


The original design intention of the XC7Z035-2FFG676I was to provide a powerful and reliable solution for a variety of applications. Its capabilities are such that it can be used in a variety of scenarios, from high-performance digital signal processing to embedded processing and image processing. The chip model is capable of being used in advanced communication systems, as well as in networks and intelligent scenarios.


The XC7Z035-2FFG676I is also designed with future upgrades in mind. It can be upgraded to handle more complex tasks, and its capabilities can be expanded to meet the needs of more advanced applications. With its ability to be used in the era of fully intelligent systems, the XC7Z035-2FFG676I is a powerful and reliable tool for a variety of applications.


The XC7Z035-2FFG676I chip model is a powerful and versatile tool for a variety of applications. It is designed with high-performance digital signal processing, embedded processing, and image processing in mind, and is programmed using the HDL language. With its extensive feature set, the XC7Z035-2FFG676I is capable of handling a wide range of tasks. Its original design intention was to provide a powerful and reliable solution for a variety of applications. Its capabilities are such that it can be used in a variety of scenarios, from high-performance digital signal processing to embedded processing and image processing. It can also be used in advanced communication systems, as well as in networks and intelligent scenarios.


The XC7Z035-2FFG676I is designed with future upgrades in mind. It can be upgraded to handle more complex tasks, and its capabilities can be expanded to meet the needs of more advanced applications. With its ability to be used in the era of fully intelligent systems, the XC7Z035-2FFG676I is a powerful and reliable tool for a variety of applications. It can be used in a variety of intelligent scenarios, such as autonomous driving, robotics, and machine learning. It can also be used in networks for high-speed data transmission and communication.


The XC7Z035-2FFG676I chip model is a powerful and versatile tool for a variety of applications. It is designed with high-performance digital signal processing, embedded processing, and image processing in mind, and is programmed using the HDL language. With its extensive feature set, the XC7Z035-2FFG676I is capable of handling a wide range of tasks. Its original design intention was to provide a powerful and reliable solution for a variety of applications. It can be used in a variety of intelligent scenarios, such as autonomous driving, robotics, and machine learning. It can also be used in networks for high-speed data transmission and communication. Its capabilities are such that it can be used in a variety of scenarios, from high-performance digital signal processing to embedded processing and image processing. It can also be used in advanced communication systems, as well as in networks and intelligent scenarios. Furthermore, it is designed with future upgrades in mind, allowing it to be used in the era of fully intelligent systems.


The XC7Z035-2FFG676I chip model is a powerful and versatile tool for a variety of applications. With its extensive feature set, it is capable of handling a wide range of tasks. It is designed with high-performance digital signal processing, embedded processing, and image processing in mind, and is programmed using the HDL language. It can be used in a variety of intelligent scenarios, such as autonomous driving, robotics, and machine learning. It can also be used in networks for high-speed data transmission and communication. It is also designed with future upgrades in mind, allowing it to be used in the era of fully intelligent systems. In short, the XC7Z035-2FFG676I is a powerful and reliable tool for a variety of applications, offering a wide range of capabilities and possibilities for the future.



3,177 In Stock


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Unit Price: $106.5285
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $99.0715 $99.0715
10+ $98.0062 $980.0622
100+ $92.6798 $9,267.9795
1000+ $87.3534 $43,676.6850
10000+ $79.8964 $79,896.3750
The price is for reference only, please refer to the actual quotation!

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