AMD Xilinx
XC7Z035-2FBG676I
XC7Z035-2FBG676I ECAD Model
XC7Z035-2FBG676I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 1 V | |
| uPs/uCs/Peripheral ICs Type | SYSTEM ON CHIP | |
| Technology | CMOS | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B676 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 2.54 mm | |
| Width | 27 mm | |
| Length | 27 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FBGA-676 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC7Z035-2FBG676I Datasheet Download
XC7Z035-2FBG676I Overview
The XC7Z035-2FBG676I chip model is a powerful and versatile tool for digital signal processing, embedded processing, and image processing. It is built on the latest technology and is able to meet the demands of the most advanced applications. Its main advantages are its high-performance processing capabilities, low power consumption, and flexibility to meet the needs of various applications.
The XC7Z035-2FBG676I chip model is designed to be used with HDL (Hardware Description Language) language, which allows it to be easily integrated into existing systems and to be used with the latest technologies. This makes the chip model a great choice for applications that require high-performance processing, such as embedded systems and image processing.
The XC7Z035-2FBG676I chip model is expected to be in high demand in the coming years as more and more applications require the use of this type of chip. This is due to its ability to handle a wide range of tasks, such as high-performance signal processing, embedded systems, and image processing. With the increasing demand for more sophisticated applications, the XC7Z035-2FBG676I chip model is expected to become even more popular.
The XC7Z035-2FBG676I chip model is also expected to benefit from the development of new technologies. It is likely that the chip model will be able to take advantage of new hardware and software technologies, such as artificial intelligence, machine learning, and the Internet of Things. This will enable the chip model to become even more powerful and efficient, and to meet the demands of more advanced applications.
In summary, the XC7Z035-2FBG676I chip model is a powerful and versatile tool for digital signal processing, embedded processing, and image processing. It is built on the latest technology and is able to meet the demands of the most advanced applications. It is expected to be in high demand in the coming years, and will likely benefit from the development of new technologies. With the increasing demand for more sophisticated applications, the XC7Z035-2FBG676I chip model is expected to become even more popular.
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1,943 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,691.0101 | $1,691.0101 |
| 10+ | $1,672.8272 | $16,728.2717 |
| 100+ | $1,581.9126 | $158,191.2648 |
| 1000+ | $1,490.9981 | $745,499.0640 |
| 10000+ | $1,363.7178 | $1,363,717.8000 |
| The price is for reference only, please refer to the actual quotation! | ||