AMD Xilinx
XC7Z035-2FBG676E
XC7Z035-2FBG676E ECAD Model
XC7Z035-2FBG676E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 1 V | |
| uPs/uCs/Peripheral ICs Type | SYSTEM ON CHIP | |
| Technology | CMOS | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B676 | |
| Operating Temperature-Max | 100 °C | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 2.54 mm | |
| Width | 27 mm | |
| Length | 27 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC7Z035-2FBG676E Datasheet Download
XC7Z035-2FBG676E Overview
The XC7Z035-2FBG676E chip model is a high-performance digital signal processing, embedded processing, and image processing chip from the renowned Xilinx Corporation. It is designed to provide users with the ability to create and implement complex designs with a minimum of resources and time. The chip model is programmed using the HDL (Hardware Description Language) language, which makes it a versatile and powerful tool for developing applications.
The XC7Z035-2FBG676E chip model is well-suited for use in many industries, including automotive, medical, telecommunications, and consumer electronics. In addition, the chip model is capable of supporting the development of future intelligent robots, as it can be used to create a variety of complex algorithms and programs. To effectively utilize the chip model, technical expertise in the HDL language is required.
As the demand for intelligent robots and other sophisticated applications continues to grow, the need for powerful processors like the XC7Z035-2FBG676E chip model will also increase. To remain competitive in the market, Xilinx and other chip manufacturers will need to ensure that their products are capable of supporting the latest technologies. This could include the development of advanced algorithms, the integration of AI capabilities, and the utilization of new programming languages.
The XC7Z035-2FBG676E chip model is an excellent choice for those looking to develop and implement high-performance digital signal processing, embedded processing, and image processing applications. With its versatile programming language and powerful capabilities, the model is well-suited for use in a variety of industries. To effectively utilize the chip model, technical expertise in the HDL language is required. As the demand for intelligent robots and other sophisticated applications continues to grow, the need for powerful processors like the XC7Z035-2FBG676E chip model will also increase, making it a great choice for those looking to stay ahead of the curve.
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2,421 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,971.9917 | $3,971.9917 |
| 10+ | $3,929.2821 | $39,292.8210 |
| 100+ | $3,715.7342 | $371,573.4156 |
| 1000+ | $3,502.1862 | $1,751,093.1080 |
| 10000+ | $3,203.2191 | $3,203,219.1000 |
| The price is for reference only, please refer to the actual quotation! | ||