AMD Xilinx
XC7Z035-1FFG900I
XC7Z035-1FFG900I ECAD Model
XC7Z035-1FFG900I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 1 V | |
| uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SYSTEM ON CHIP | |
| Technology | CMOS | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B900 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 3.35 mm | |
| Width | 31 mm | |
| Length | 31 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FBGA-900 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC7Z035-1FFG900I Datasheet Download
XC7Z035-1FFG900I Overview
The XC7Z035-1FFG900I chip model is a powerful and versatile tool for digital signal processing, embedded processing, and image processing. It is designed to meet the needs of high-performance applications and requires the use of HDL (Hardware Description Language) to program it. This model stands out from the competition due to its high-performance capabilities and its ability to be used in various industries.
The XC7Z035-1FFG900I chip model has several advantages that make it an attractive option for digital signal processing, embedded processing, and image processing applications. It has a high-speed transceiver, which allows for fast data transfer between the chip and other devices. Additionally, the model is designed with a low power consumption, making it ideal for low-power applications. Furthermore, the model has a wide range of peripherals, including Ethernet, USB, and CAN, which can be used for communication and data transfer.
The XC7Z035-1FFG900I chip model is expected to be in high demand in the future due to its versatility and its ability to be used in various industries. It is expected to be used in the automotive, medical, and industrial sectors, as well as in consumer electronics. Additionally, the model is expected to be used in the development of intelligent robots, as it has the capability to process large amounts of data quickly and accurately.
The XC7Z035-1FFG900I chip model can be applied to the development and popularization of future intelligent robots. The model has the capability to process large amounts of data quickly and accurately, making it ideal for use in robotics applications. To use the model effectively, it is important to have the necessary technical knowledge and skills, such as experience with HDL programming and knowledge of digital signal processing, embedded processing, and image processing. Additionally, knowledge of robotics and AI algorithms may be necessary for more complex applications.
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5,525 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $773.2125 | $773.2125 |
| 10+ | $764.8984 | $7,648.9840 |
| 100+ | $723.3278 | $72,332.7831 |
| 1000+ | $681.7573 | $340,878.6330 |
| 10000+ | $623.5585 | $623,558.4750 |
| The price is for reference only, please refer to the actual quotation! | ||