AMD Xilinx
XC7Z035-1FFG900C
XC7Z035-1FFG900C ECAD Model
XC7Z035-1FFG900C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 1 V | |
| uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SYSTEM ON CHIP | |
| Technology | CMOS | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B900 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 3.35 mm | |
| Width | 31 mm | |
| Length | 31 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC7Z035-1FFG900C Datasheet Download
XC7Z035-1FFG900C Overview
The XC7Z035-1FFG900C is a powerful and versatile chip model developed by Xilinx, a leading provider of programmable logic solutions. It is designed to meet the needs of many high-performance digital signal processing, embedded processing, image processing, and other applications. It is built on a 28nm process, with a Zynq-7000 architecture, and contains a dual-core ARM Cortex-A9 processor and an FPGA fabric.
The XC7Z035-1FFG900C is designed to be highly flexible, allowing users to easily customize their designs to meet their specific needs. It is capable of handling complex tasks such as advanced communication systems, and can be upgraded in the future for added performance. The chip model is programmed in the HDL language, allowing for quick and easy development of applications.
When using the XC7Z035-1FFG900C, it is important to consider the product description and design requirements. The chip model is designed to be used in high-performance digital signal processing, embedded processing, and image processing applications. It is important to consider the specific design requirements of the chip model in order to ensure that the application is running optimally.
The XC7Z035-1FFG900C is a powerful and versatile chip model that can be used in a variety of applications. In order to ensure that the chip model is used optimally, it is important to consider the product description and design requirements, as well as actual case studies. Additionally, it is important to consider the original design intention of the chip model, as well as whether the chip model can be upgraded in the future for added performance. By understanding the capabilities and limitations of the XC7Z035-1FFG900C, users can ensure that their applications are running optimally.
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2,853 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $898.3631 | $898.3631 |
| 10+ | $888.7033 | $8,887.0326 |
| 100+ | $840.4042 | $84,040.4166 |
| 1000+ | $792.1051 | $396,052.5380 |
| 10000+ | $724.4864 | $724,486.3500 |
| The price is for reference only, please refer to the actual quotation! | ||