
AMD Xilinx
XC7Z035-1FFG676I
XC7Z035-1FFG676I ECAD Model
XC7Z035-1FFG676I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 1 V | |
uPs/uCs/Peripheral ICs Type | SYSTEM ON CHIP | |
Technology | CMOS | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B676 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA676,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Seated Height-Max | 3.24 mm | |
Width | 27 mm | |
Length | 27 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC7Z035-1FFG676I Datasheet Download
XC7Z035-1FFG676I Overview
XC7Z035-1FFG676I is a high-performance chip model manufactured by Xilinx, Inc. It is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, image processing, and so on. The chip model is designed to be used with the HDL language, which is a hardware description language used for writing, simulating, and synthesizing code for FPGAs (Field-Programmable Gate Arrays).
The XC7Z035-1FFG676I chip model offers a number of advantages compared to other chip models. It is designed to be fast and efficient, offering excellent performance in terms of speed and power consumption. It also offers a wide range of features that make it suitable for a variety of applications. It has a wide range of I/O (Input/Output) options, allowing it to be used in a wide range of applications.
In addition to its advantages, the XC7Z035-1FFG676I chip model is also expected to be in high demand in the future. As more and more applications are developed for the chip model, the demand for it is expected to increase. This is especially true for applications related to digital signal processing, embedded processing, and image processing.
In terms of product description, the XC7Z035-1FFG676I chip model is designed to be used with the HDL language. It has a wide range of I/O options, including Ethernet, PCIe, SATA, USB, HDMI, and more. It also has a wide range of features, such as a high-speed system clock, a wide range of memory options, and a wide range of power options.
When designing a system with the XC7Z035-1FFG676I chip model, it is important to consider the specific requirements of the system. For example, the system should be designed to meet the specific needs of the application and the design should be optimized for the specific chip model. It is also important to consider the power requirements of the system, as the chip model is designed to be power efficient.
In addition, there are a number of case studies that can be used to help understand the design process and the potential applications of the XC7Z035-1FFG676I chip model. These case studies can provide valuable insight into the design process and the potential applications of the chip model.
Finally, when using the XC7Z035-1FFG676I chip model, it is important to take the necessary precautions. For example, the system should be designed to meet the specific needs of the application and the design should be optimized for the specific chip model. It is also important to ensure that the system is operating within the power requirements of the chip model. Additionally, it is important to ensure that the system is properly tested and verified before it is deployed.
In conclusion, the XC7Z035-1FFG676I chip model is a high-performance chip model manufactured by Xilinx, Inc. It is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, image processing, and so on. The chip model is designed to be used with the HDL language, which is a hardware description language used for writing, simulating, and synthesizing code for FPGAs (Field-Programmable Gate Arrays). The XC7Z035-1FFG676I chip model offers a number of advantages compared to other chip models and is expected to be in high demand in the future. When designing a system with the XC7Z035-1FFG676I chip model, it is important to consider the specific requirements of the system and to take the necessary precautions.
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4,633 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $4,317.1184 | $4,317.1184 |
10+ | $4,270.6978 | $42,706.9778 |
100+ | $4,038.5946 | $403,859.4636 |
1000+ | $3,806.4915 | $1,903,245.7480 |
10000+ | $3,481.5471 | $3,481,547.1000 |
The price is for reference only, please refer to the actual quotation! |