XC7Z035-1FFG676I
XC7Z035-1FFG676I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC7Z035-1FFG676I


XC7Z035-1FFG676I
F20-XC7Z035-1FFG676I
Active
CMOS, BGA
BGA

XC7Z035-1FFG676I ECAD Model


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XC7Z035-1FFG676I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 1 V
uPs/uCs/Peripheral ICs Type SYSTEM ON CHIP
Technology CMOS
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B676
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Seated Height-Max 3.24 mm
Width 27 mm
Length 27 mm
Ihs Manufacturer XILINX INC
Package Description BGA,
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC7Z035-1FFG676I Datasheet Download


XC7Z035-1FFG676I Overview



XC7Z035-1FFG676I is a high-performance chip model manufactured by Xilinx, Inc. It is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, image processing, and so on. The chip model is designed to be used with the HDL language, which is a hardware description language used for writing, simulating, and synthesizing code for FPGAs (Field-Programmable Gate Arrays).


The XC7Z035-1FFG676I chip model offers a number of advantages compared to other chip models. It is designed to be fast and efficient, offering excellent performance in terms of speed and power consumption. It also offers a wide range of features that make it suitable for a variety of applications. It has a wide range of I/O (Input/Output) options, allowing it to be used in a wide range of applications.


In addition to its advantages, the XC7Z035-1FFG676I chip model is also expected to be in high demand in the future. As more and more applications are developed for the chip model, the demand for it is expected to increase. This is especially true for applications related to digital signal processing, embedded processing, and image processing.


In terms of product description, the XC7Z035-1FFG676I chip model is designed to be used with the HDL language. It has a wide range of I/O options, including Ethernet, PCIe, SATA, USB, HDMI, and more. It also has a wide range of features, such as a high-speed system clock, a wide range of memory options, and a wide range of power options.


When designing a system with the XC7Z035-1FFG676I chip model, it is important to consider the specific requirements of the system. For example, the system should be designed to meet the specific needs of the application and the design should be optimized for the specific chip model. It is also important to consider the power requirements of the system, as the chip model is designed to be power efficient.


In addition, there are a number of case studies that can be used to help understand the design process and the potential applications of the XC7Z035-1FFG676I chip model. These case studies can provide valuable insight into the design process and the potential applications of the chip model.


Finally, when using the XC7Z035-1FFG676I chip model, it is important to take the necessary precautions. For example, the system should be designed to meet the specific needs of the application and the design should be optimized for the specific chip model. It is also important to ensure that the system is operating within the power requirements of the chip model. Additionally, it is important to ensure that the system is properly tested and verified before it is deployed.


In conclusion, the XC7Z035-1FFG676I chip model is a high-performance chip model manufactured by Xilinx, Inc. It is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, image processing, and so on. The chip model is designed to be used with the HDL language, which is a hardware description language used for writing, simulating, and synthesizing code for FPGAs (Field-Programmable Gate Arrays). The XC7Z035-1FFG676I chip model offers a number of advantages compared to other chip models and is expected to be in high demand in the future. When designing a system with the XC7Z035-1FFG676I chip model, it is important to consider the specific requirements of the system and to take the necessary precautions.



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Unit Price: $4,642.0628
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Pricing (USD)

QTY Unit Price Ext Price
1+ $4,317.1184 $4,317.1184
10+ $4,270.6978 $42,706.9778
100+ $4,038.5946 $403,859.4636
1000+ $3,806.4915 $1,903,245.7480
10000+ $3,481.5471 $3,481,547.1000
The price is for reference only, please refer to the actual quotation!

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