
AMD Xilinx
XC7Z035-1FBG676I
XC7Z035-1FBG676I ECAD Model
XC7Z035-1FBG676I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 1 V | |
uPs/uCs/Peripheral ICs Type | SYSTEM ON CHIP | |
Technology | CMOS | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B676 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA676,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Seated Height-Max | 2.54 mm | |
Width | 27 mm | |
Length | 27 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC7Z035-1FBG676I Datasheet Download
XC7Z035-1FBG676I Overview
The XC7Z035-1FBG676I chip model is a powerful and versatile tool for a wide range of applications. It was designed with the intention of providing a cost-effective solution for advanced communication systems. This chip model is based on the Xilinx 7-series FPGA architecture, which enables the chip to process data quickly and accurately.
The XC7Z035-1FBG676I is an ideal choice for applications such as 5G networks, artificial intelligence, and the Internet of Things (IoT). It has the capability to handle complex tasks, such as signal processing, high-speed data transfer, and network security. The chip is also capable of supporting multiple protocols, such as Ethernet and Wi-Fi, allowing it to be used in a variety of applications.
The XC7Z035-1FBG676I is designed with a range of features to optimize performance. It has a high-speed memory, a low-power design, and a wide range of I/O options. The chip also features an advanced power management system, which helps to reduce power consumption. Additionally, the chip is equipped with a range of debugging and programming tools to make it easier to develop applications with the chip.
The XC7Z035-1FBG676I is a highly reliable chip, and it has been used in a variety of applications, from wireless communication systems to medical equipment. It is possible to upgrade the chip in the future, allowing for more advanced features and capabilities. The chip is also capable of being used in the era of fully intelligent systems, where it can be used to power a range of applications.
When designing applications with the XC7Z035-1FBG676I, it is important to consider the product description and specific design requirements. The chip is designed to be used in a variety of applications, and it is important to ensure that the design meets the requirements of the application. Additionally, it is important to consider the actual case studies and precautions when designing with the chip.
The XC7Z035-1FBG676I chip model is a powerful and versatile tool for a variety of applications. It is designed with the intention of providing a cost-effective solution for advanced communication systems, and it is capable of being used in the era of fully intelligent systems. The chip has a range of features to optimize performance and reliability, and it is possible to upgrade the chip in the future. When designing applications with the XC7Z035-1FBG676I, it is important to consider the product description and specific design requirements, as well as actual case studies and precautions.
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5,161 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $3,451.2740 | $3,451.2740 |
10+ | $3,414.1635 | $34,141.6352 |
100+ | $3,228.6112 | $322,861.1151 |
1000+ | $3,043.0588 | $1,521,529.3930 |
10000+ | $2,783.2855 | $2,783,285.4750 |
The price is for reference only, please refer to the actual quotation! |