XC7Z035-1FBG676C
XC7Z035-1FBG676C
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rohs

AMD Xilinx

XC7Z035-1FBG676C


XC7Z035-1FBG676C
F20-XC7Z035-1FBG676C
Active
CMOS, FBGA-676
FBGA-676

XC7Z035-1FBG676C ECAD Model


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XC7Z035-1FBG676C Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 1 V
uPs/uCs/Peripheral ICs Type SYSTEM ON CHIP
Technology CMOS
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B676
Operating Temperature-Max 85 °C
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Seated Height-Max 2.54 mm
Width 27 mm
Length 27 mm
Ihs Manufacturer XILINX INC
Package Description FBGA-676
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC7Z035-1FBG676C Datasheet Download


XC7Z035-1FBG676C Overview



The chip model XC7Z035-1FBG676C is a powerful and versatile device that is suitable for many applications. It is most commonly used in high-performance digital signal processing, embedded processing, and image processing, and requires the use of HDL language. This chip has many advantages, such as a high processing speed, low power consumption, and a wide range of applications.


The demand for XC7Z035-1FBG676C is expected to grow in the future, as more industries are looking for powerful and reliable solutions to their processing needs. It is expected to be used in more applications, such as in networks, intelligent scenarios, and even in the era of fully intelligent systems. This chip can be used to process large amounts of data quickly, and its low power consumption makes it ideal for use in mobile devices.


The chip model XC7Z035-1FBG676C can be used for a variety of applications, including network monitoring, video streaming, and image processing. It can also be used for artificial intelligence and machine learning applications, as well as for autonomous vehicles. In the future, this chip could be used in fully intelligent systems, such as self-driving cars and smart homes. This chip could also be used to process large amounts of data in real-time, making it ideal for use in the internet of things.


Overall, the chip model XC7Z035-1FBG676C is a powerful and versatile device that is suitable for a variety of applications. It has many advantages, such as a high processing speed, low power consumption, and a wide range of applications. The demand for this chip is expected to grow in the future, as more industries are looking for powerful and reliable solutions to their processing needs. It can be used for a variety of applications, including network monitoring, video streaming, and image processing, as well as for artificial intelligence and machine learning applications. In the future, this chip could be used in fully intelligent systems, such as self-driving cars and smart homes.



2,805 In Stock


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Unit Price: $3,268.7616
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $3,039.9483 $3,039.9483
10+ $3,007.2607 $30,072.6067
100+ $2,843.8226 $284,382.2592
1000+ $2,680.3845 $1,340,192.2560
10000+ $2,451.5712 $2,451,571.2000
The price is for reference only, please refer to the actual quotation!

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