XC7Z030-L2FBG676I
XC7Z030-L2FBG676I
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rohs

AMD Xilinx

XC7Z030-L2FBG676I


XC7Z030-L2FBG676I
F20-XC7Z030-L2FBG676I
Active
CMOS, BGA
BGA

XC7Z030-L2FBG676I ECAD Model


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XC7Z030-L2FBG676I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 1 V
uPs/uCs/Peripheral ICs Type SYSTEM ON CHIP
Technology CMOS
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B676
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Seated Height-Max 2.54 mm
Width 27 mm
Length 27 mm
Ihs Manufacturer XILINX INC
Package Description BGA,
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC7Z030-L2FBG676I Datasheet Download


XC7Z030-L2FBG676I Overview



The XC7Z030-L2FBG676I chip model is a high-performance and high-density programmable logic device (PLD) that has been designed with the intention to provide superior performance and flexibility. It is based on the latest Xilinx 7 series FPGA technology, and is capable of supporting high-speed serial transceivers, advanced memory interfaces, and high-speed I/O. This model has been designed to be used in a wide range of applications such as communications, embedded systems, and industrial automation.


The XC7Z030-L2FBG676I chip model is capable of providing up to 676K logic cells, which are the building blocks for logic functions. This model also supports up to 8GB of RAM, as well as up to 4GB of Flash memory, allowing for the storage of large amounts of data. In addition, this model also supports up to 12 high-speed serial transceivers, allowing for the transmission of data at speeds of up to 12.5 Gbps.


The XC7Z030-L2FBG676I chip model has the potential to be upgraded in the future to meet the needs of more advanced applications. For example, it can be upgraded to support higher speed transceivers, higher resolution displays, or larger memory sizes. It can also be used to develop and popularize future intelligent robots, as it is capable of providing the necessary processing power and flexibility for controlling robotic systems.


In order to use the XC7Z030-L2FBG676I chip model effectively, technical talents with knowledge in FPGA design and embedded systems are necessary. Knowledge of VHDL and Verilog programming languages is also required in order to be able to program the chip properly. Additionally, knowledge of circuit design and debugging techniques are also important in order to be able to troubleshoot any issues that may arise.


Case studies and precautions should also be taken into consideration when using the XC7Z030-L2FBG676I chip model. For example, power consumption should be monitored closely and the chip should be operated within the specified temperature range. Additionally, the chip should be tested and verified before being used in any production environment.


Overall, the XC7Z030-L2FBG676I chip model is a powerful and flexible programmable logic device that has been designed to meet the needs of a wide range of applications. It has the potential to be upgraded in the future to meet the needs of more advanced applications, and can also be used to develop and popularize future intelligent robots. In order to use the model effectively, technical talents with knowledge in FPGA design and embedded systems are necessary, and case studies and precautions should also be taken into consideration.



1,875 In Stock


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Unit Price: $237.0713
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $220.4763 $220.4763
10+ $218.1056 $2,181.0560
100+ $206.2520 $20,625.2031
1000+ $194.3985 $97,199.2330
10000+ $177.8035 $177,803.4750
The price is for reference only, please refer to the actual quotation!

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