AMD Xilinx
XC7Z030-L2FBG484I
XC7Z030-L2FBG484I ECAD Model
XC7Z030-L2FBG484I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 1 V | |
| uPs/uCs/Peripheral ICs Type | SYSTEM ON CHIP | |
| Technology | CMOS | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B484 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 2.54 mm | |
| Width | 23 mm | |
| Length | 23 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FBGA-484 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC7Z030-L2FBG484I Datasheet Download
XC7Z030-L2FBG484I Overview
The XC7Z030-L2FBG484I chip model is a powerful and versatile chip designed to meet the needs of a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. It is designed to provide the highest levels of performance and flexibility, while also being able to be upgraded and adapted to new technologies as needed.
The XC7Z030-L2FBG484I chip model is designed with advanced communication systems in mind. It is capable of handling the most demanding tasks, such as high-speed data transmission, voice communication, and image processing. It is also designed to be able to be upgraded and adapted to new technologies as needed.
The XC7Z030-L2FBG484I chip model has the potential to become a major player in the industry. It is designed to be able to keep up with the ever-evolving needs of the industry and to be able to provide the highest levels of performance and flexibility. As new technologies emerge, the chip model can be upgraded to meet the needs of the industry.
The industry trends of the chip model XC7Z030-L2FBG484I and the future development of related industries will depend on what specific technologies are needed. As new technologies become available, the chip model can be upgraded to meet the needs of the industry. The chip model is designed to be able to keep up with the ever-evolving needs of the industry and to be able to provide the highest levels of performance and flexibility.
The original design intention of the chip model XC7Z030-L2FBG484I was to provide the highest levels of performance and flexibility while also being able to be upgraded and adapted to new technologies as needed. It is designed to be able to keep up with the ever-evolving needs of the industry and to be able to provide the highest levels of performance and flexibility. As new technologies emerge, the chip model can be upgraded to meet the needs of the industry.
In conclusion, the XC7Z030-L2FBG484I chip model is a powerful and versatile chip designed to meet the needs of a variety of applications. It is designed to provide the highest levels of performance and flexibility, while also being able to be upgraded and adapted to new technologies as needed. The industry trends of the chip model and the future development of related industries will depend on what specific technologies are needed. The original design intention of the chip model was to provide the highest levels of performance and flexibility while also being able to be upgraded and adapted to new technologies as needed.
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3,949 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $411.8111 | $411.8111 |
| 10+ | $407.3830 | $4,073.8299 |
| 100+ | $385.2426 | $38,524.2612 |
| 1000+ | $363.1022 | $181,551.1160 |
| 10000+ | $332.1057 | $332,105.7000 |
| The price is for reference only, please refer to the actual quotation! | ||