AMD Xilinx
XC7Z030-3SBG485E
XC7Z030-3SBG485E ECAD Model
XC7Z030-3SBG485E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 1 V | |
| uPs/uCs/Peripheral ICs Type | SYSTEM ON CHIP | |
| Technology | CMOS | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B485 | |
| Operating Temperature-Max | 100 °C | |
| Number of Terminals | 485 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA485,22X22,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 2.44 mm | |
| Width | 19 mm | |
| Length | 19 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FBGA, BGA484,22X22,32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC7Z030-3SBG485E Datasheet Download
XC7Z030-3SBG485E Overview
The XC7Z030-3SBG485E chip model is a high-performance, embedded processing, digital signal processing, and image processing solution. It is a field-programmable gate array (FPGA) device, which is a programmable logic device that is configured by the customer or designer after manufacturing. This chip model is designed for use with high-level hardware description languages (HDLs) such as Verilog and VHDL, which are used to create designs for FPGA devices.
The XC7Z030-3SBG485E chip model is designed to provide high-performance solutions for digital signal processing, embedded processing, and image processing applications. It is capable of providing up to 485K logic cells and is equipped with a large number of high-speed transceivers and memory blocks. Additionally, the XC7Z030-3SBG485E chip model is designed to be power efficient and is able to operate at a relatively low voltage.
The XC7Z030-3SBG485E chip model is expected to experience increasing demand in the near future, as it is well suited to the ever-growing demand for high-performance embedded processing and digital signal processing solutions. This chip model is also expected to experience increased demand in the image processing sector, as it is capable of providing high-quality image processing solutions.
The original design intention of the XC7Z030-3SBG485E chip model was to provide high-performance solutions for digital signal processing, embedded processing, and image processing. The chip model is designed to be easily upgradeable and is capable of being used in more advanced communication systems. Additionally, the XC7Z030-3SBG485E chip model is designed to be compatible with a variety of different HDLs, making it a versatile solution for many different applications.
In conclusion, the XC7Z030-3SBG485E chip model is a high-performance, embedded processing, digital signal processing, and image processing solution. It is designed to be power efficient, easily upgradeable, and compatible with a variety of HDLs. The chip model is expected to experience increasing demand in the near future, as it is well suited to the ever-growing demand for high-performance embedded processing and digital signal processing solutions. Additionally, the XC7Z030-3SBG485E chip model is capable of being used in more advanced communication systems.
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2,624 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,219.1793 | $1,219.1793 |
| 10+ | $1,206.0699 | $12,060.6986 |
| 100+ | $1,140.5226 | $114,052.2585 |
| 1000+ | $1,074.9753 | $537,487.6550 |
| 10000+ | $983.2091 | $983,209.1250 |
| The price is for reference only, please refer to the actual quotation! | ||