AMD Xilinx
XC7Z030-3FFG676E
XC7Z030-3FFG676E ECAD Model
XC7Z030-3FFG676E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 1 V | |
| uPs/uCs/Peripheral ICs Type | SYSTEM ON CHIP | |
| Technology | CMOS | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B676 | |
| Operating Temperature-Max | 100 °C | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 3.24 mm | |
| Width | 27 mm | |
| Length | 27 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC7Z030-3FFG676E Datasheet Download
XC7Z030-3FFG676E Overview
The chip model XC7Z030-3FFG676E is a powerful and versatile chip from Xilinx, a leading provider of programmable logic solutions. It features a high-performance, low-power architecture and is designed to meet the needs of a wide range of applications. Its advanced features and capabilities make it an ideal choice for a variety of applications, including communications, networking, and embedded systems.
The XC7Z030-3FFG676E is designed with the latest technologies to provide maximum performance and flexibility. It supports the latest technologies including FPGA, Ethernet, and USB, and is compatible with a wide range of operating systems. It also has a wide range of features, such as an on-board memory controller, a high-speed clock generator, and an advanced power management system.
The XC7Z030-3FFG676E is designed to be able to handle the most demanding applications. It is capable of supporting advanced communication systems, such as 5G and Wi-Fi 6, and can be used for a variety of applications, such as machine learning and artificial intelligence. It can also be used in networks, allowing it to be applied to a variety of intelligent scenarios.
The XC7Z030-3FFG676E is designed to be future-proof, meaning that it can be upgraded as technology advances. This means that it can be used in the era of fully intelligent systems, such as the Internet of Things (IoT) and autonomous vehicles. It also has the potential to be used in a variety of other applications, such as smart homes and robotics.
The XC7Z030-3FFG676E is a highly advanced and versatile chip that provides a wide range of features and capabilities. It is designed to meet the needs of a variety of applications, and its advanced features and capabilities make it an ideal choice for a variety of applications, including communications, networking, and embedded systems. It is capable of supporting advanced communication systems, such as 5G and Wi-Fi 6, and can be used for a variety of applications, such as machine learning and artificial intelligence. It is also designed to be future-proof, meaning that it can be upgraded as technology advances, allowing it to be used in the era of fully intelligent systems, such as the Internet of Things (IoT) and autonomous vehicles. With its powerful and versatile features, the XC7Z030-3FFG676E is an excellent choice for a wide range of applications.
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1,102 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $465.4552 | $465.4552 |
| 10+ | $460.4503 | $4,604.5034 |
| 100+ | $435.4259 | $43,542.5865 |
| 1000+ | $410.4014 | $205,200.6950 |
| 10000+ | $375.3671 | $375,367.1250 |
| The price is for reference only, please refer to the actual quotation! | ||