AMD Xilinx
XC7Z030-3FBG484E
XC7Z030-3FBG484E ECAD Model
XC7Z030-3FBG484E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 1 V | |
| uPs/uCs/Peripheral ICs Type | SYSTEM ON CHIP | |
| Technology | CMOS | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B484 | |
| Operating Temperature-Max | 100 °C | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 2.54 mm | |
| Width | 23 mm | |
| Length | 23 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FBGA-484 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC7Z030-3FBG484E Datasheet Download
XC7Z030-3FBG484E Overview
The XC7Z030-3FBG484E chip model has been gaining popularity in the industry due to its powerful performance and unique features. This model has the capacity to provide a reliable and secure connection for various applications, including networking, storage, and other embedded systems. It is also capable of supporting high-speed data transfers and can process large amounts of data quickly.
The XC7Z030-3FBG484E chip model is a versatile one and can be used in a variety of scenarios. It is particularly useful in networks, where it can be used to provide a secure connection for data transmission. This model is also suitable for storage applications, as it can store large amounts of data securely. Additionally, the chip model can be used in embedded systems, where it can be used to control and monitor various devices.
The XC7Z030-3FBG484E chip model is expected to be in high demand in the future, as it is suitable for a variety of applications and can be used in different scenarios. It is also expected to be used in the era of fully intelligent systems, where it can be used to control various devices and systems with greater efficiency. Moreover, it can also be used in networks to provide a secure connection for data transmission.
The XC7Z030-3FBG484E chip model is expected to be used in a variety of intelligent scenarios, such as in automated homes and smart cities. It can be used to control and monitor a variety of devices, such as lights, air conditioners, and security systems. It can also be used to provide a secure connection for data transmission. Additionally, the chip model can be used to provide an efficient and reliable platform for various applications, such as artificial intelligence and machine learning.
In conclusion, the XC7Z030-3FBG484E chip model is a powerful and versatile one and is expected to be in high demand in the future. It is suitable for a variety of applications and can be used in different scenarios. Additionally, it can be used in the era of fully intelligent systems, where it can be used to control and monitor various devices and systems with greater efficiency. It is also expected to be used in a variety of intelligent scenarios, such as in automated homes and smart cities. Therefore, it is important to assess the application environment and determine which specific technologies are needed in order to determine the future development of the chip model and related industries.
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4,932 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $411.8111 | $411.8111 |
| 10+ | $407.3830 | $4,073.8299 |
| 100+ | $385.2426 | $38,524.2612 |
| 1000+ | $363.1022 | $181,551.1160 |
| 10000+ | $332.1057 | $332,105.7000 |
| The price is for reference only, please refer to the actual quotation! | ||