AMD Xilinx
XC7Z030-2FFG676I
XC7Z030-2FFG676I ECAD Model
XC7Z030-2FFG676I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 1 V | |
| uPs/uCs/Peripheral ICs Type | SYSTEM ON CHIP | |
| Technology | CMOS | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B676 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 3.24 mm | |
| Width | 27 mm | |
| Length | 27 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-676 | |
| Pin Count | 676 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC7Z030-2FFG676I Datasheet Download
XC7Z030-2FFG676I Overview
The Xilinx XC7Z030-2FFG676I chip model is an advanced FPGA that is designed to meet the needs of a wide range of applications. It is a highly versatile device that can be used for a variety of tasks, including image processing, data analysis, and signal processing. With its high-speed operation, low power consumption, and excellent performance, the XC7Z030-2FFG676I is an ideal choice for many industries.
The XC7Z030-2FFG676I has become increasingly popular in the industry due to its advanced features and reliable performance. It is an excellent choice for applications that require high-speed operation, low power consumption, and excellent performance. The chip is also suitable for applications that require high-speed data transfer, such as networking and storage.
The XC7Z030-2FFG676I is a great choice for applications that require the support of new technologies. It is capable of supporting the latest technologies, such as 5G, Wi-Fi 6, and Bluetooth 5.0. With its powerful processing capabilities, the chip is also able to handle complex tasks, such as AI and machine learning. Furthermore, the XC7Z030-2FFG676I is suitable for applications that require high-speed data transfer, such as networks and storage.
The XC7Z030-2FFG676I is also suitable for applications in the era of fully intelligent systems. It is capable of handling complex tasks such as AI and machine learning, and its powerful processing capabilities make it an ideal choice for these applications. Furthermore, the chip is also capable of supporting the latest technologies, such as 5G, Wi-Fi 6, and Bluetooth 5.0, which are essential for the future of intelligent systems.
The XC7Z030-2FFG676I is a powerful and versatile chip that is suitable for a wide range of applications. It is an excellent choice for applications that require high-speed operation, low power consumption, and excellent performance. Furthermore, the chip is also suitable for applications in the era of fully intelligent systems. With its advanced features and reliable performance, the XC7Z030-2FFG676I is expected to remain in high demand in the coming years.
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2,802 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $57.7871 | $57.7871 |
| 10+ | $57.1658 | $571.6576 |
| 100+ | $54.0589 | $5,405.8929 |
| 1000+ | $50.9521 | $25,476.0470 |
| 10000+ | $46.6025 | $46,602.5250 |
| The price is for reference only, please refer to the actual quotation! | ||