AMD Xilinx
XC7Z030-2FBG676I
XC7Z030-2FBG676I ECAD Model
XC7Z030-2FBG676I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 1 V | |
| uPs/uCs/Peripheral ICs Type | SYSTEM ON CHIP | |
| Technology | CMOS | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B676 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 2.54 mm | |
| Width | 27 mm | |
| Length | 27 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC7Z030-2FBG676I Datasheet Download
XC7Z030-2FBG676I Overview
The XC7Z030-2FBG676I is a powerful chip model designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to be programmed using HDL (Hardware Description Language) and is capable of providing high-performance solutions for a variety of applications.
The XC7Z030-2FBG676I chip model is designed to offer high performance and low power consumption. It is equipped with a large number of logic elements and memory blocks, making it suitable for a variety of applications. The chip model features a 6-stage pipeline, making it ideal for high-speed signal processing. The chip model is also designed to be highly configurable, allowing users to customize their designs to meet their exact needs.
The XC7Z030-2FBG676I chip model is expected to be widely used in a variety of industries in the future. Its high performance and low power consumption make it a great choice for embedded systems, image processing, and other applications. With its advanced features, the chip model is also expected to be used in advanced communication systems.
The original design intention of the XC7Z030-2FBG676I chip model was to provide a highly configurable and powerful solution for digital signal processing, embedded processing, and image processing applications. With its advanced features, the chip model is capable of providing high performance solutions for a variety of applications. The chip model is also designed to be upgradable, so users can easily upgrade their designs to meet their needs.
The XC7Z030-2FBG676I chip model is an ideal choice for a variety of applications. With its high performance and low power consumption, it is expected to be widely used in a variety of industries in the future. Its advanced features also make it a great choice for advanced communication systems. With its upgradability, users can easily upgrade their designs to meet their needs.
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5,847 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $175.2651 | $175.2651 |
| 10+ | $173.3805 | $1,733.8053 |
| 100+ | $163.9577 | $16,395.7677 |
| 1000+ | $154.5348 | $77,267.4110 |
| 10000+ | $141.3428 | $141,342.8250 |
| The price is for reference only, please refer to the actual quotation! | ||