XC7Z030-2FBG676E
XC7Z030-2FBG676E
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rohs

AMD Xilinx

XC7Z030-2FBG676E


XC7Z030-2FBG676E
F20-XC7Z030-2FBG676E
Active
CMOS, BGA
BGA

XC7Z030-2FBG676E ECAD Model


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XC7Z030-2FBG676E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 1 V
uPs/uCs/Peripheral ICs Type SYSTEM ON CHIP
Technology CMOS
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B676
Operating Temperature-Max 100 °C
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Seated Height-Max 2.54 mm
Width 27 mm
Length 27 mm
Ihs Manufacturer XILINX INC
Package Description BGA,
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC7Z030-2FBG676E Datasheet Download


XC7Z030-2FBG676E Overview



The XC7Z030-2FBG676E chip model is a powerful and versatile tool for a variety of applications. It was designed by Xilinx, a leader in programmable logic, to provide a low-cost, high-performance solution for a wide range of applications. The chip model is based on the Artix-7 family of FPGAs, and it is capable of providing up to 676K logic cells. This makes it suitable for many different types of projects, from low-end consumer electronics to high-end industrial applications.


The XC7Z030-2FBG676E chip model offers a number of advantages over other FPGA solutions. It is designed to be low power, and can operate at up to a maximum of 1.2 volts. This makes it suitable for applications that require low power consumption, such as portable and mobile devices. It also has a wide range of features, such as high-speed transceivers and a variety of memory options. This makes it suitable for a wide range of applications, from consumer electronics to industrial applications.


The XC7Z030-2FBG676E chip model is expected to be in high demand in the future, particularly in the communications industry. This is due to the increasing demand for high-speed data transmission, as well as the need for low power consumption. The chip model is also expected to be popular in the automotive industry, as it can be used to help power the increasing number of connected and autonomous vehicles.


The original design intention of the XC7Z030-2FBG676E chip model was to provide a low-cost, high-performance solution for a wide range of applications. It is possible to upgrade the chip model in the future, as Xilinx is constantly improving their products. This means that the chip model can be used for more advanced applications in the future, such as communication systems.


The XC7Z030-2FBG676E chip model can be used in a variety of networks, including wired and wireless networks. It is also suitable for a range of intelligent scenarios, such as machine learning and artificial intelligence. This makes it suitable for use in the era of fully intelligent systems. The chip model is also suitable for use in the Internet of Things, as it can be used to connect a range of devices and sensors to the network.


In conclusion, the XC7Z030-2FBG676E chip model is a powerful and versatile tool for a variety of applications. It was designed to provide a low-cost, high-performance solution for a wide range of applications. The chip model is expected to be in high demand in the future, particularly in the communications industry. It is also suitable for a range of intelligent scenarios, such as machine learning and artificial intelligence, and it can be used in the era of fully intelligent systems. The chip model can also be upgraded in the future, making it suitable for more advanced applications.



4,578 In Stock


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Unit Price: $1,305.5386
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,214.1509 $1,214.1509
10+ $1,201.0955 $12,010.9551
100+ $1,135.8186 $113,581.8582
1000+ $1,070.5417 $535,270.8260
10000+ $979.1540 $979,153.9500
The price is for reference only, please refer to the actual quotation!

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