AMD Xilinx
XC7Z030-1FBG676I
XC7Z030-1FBG676I ECAD Model
XC7Z030-1FBG676I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 1 V | |
| uPs/uCs/Peripheral ICs Type | SYSTEM ON CHIP | |
| Technology | CMOS | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B676 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 2.54 mm | |
| Width | 27 mm | |
| Length | 27 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC7Z030-1FBG676I Datasheet Download
XC7Z030-1FBG676I Overview
The XC7Z030-1FBG676I chip model is a highly advanced and versatile model that has been developed by Xilinx Inc. This model has been designed to deliver the highest performance and scalability for embedded systems and applications. It is a powerful and feature-rich model that offers a wide range of features and capabilities for the development of advanced communication systems.
The XC7Z030-1FBG676I chip model has been designed to provide a high level of performance and scalability for embedded systems and applications. It features a dual-core ARM Cortex-A9 processor, an integrated FPGA, and a wide range of peripherals. This chip model is also equipped with a large amount of memory, including DDR3 SDRAM, QDR SRAM, and NAND Flash. It also supports a wide range of communication protocols, including Ethernet, USB, and CAN.
The XC7Z030-1FBG676I chip model has been designed to meet the needs of the most demanding applications. It has been designed to offer a high level of performance and scalability for embedded systems and applications. It is capable of delivering high performance in a wide range of applications, including industrial automation, medical, automotive, and consumer electronics.
The XC7Z030-1FBG676I chip model is expected to experience strong demand in the future due to its versatility and scalability. It is expected to be used in a wide range of applications, including industrial automation, medical, automotive, and consumer electronics. It is also expected to be used in advanced communication systems, such as 5G networks, as well as in intelligent scenarios, such as autonomous vehicles and robotics.
The XC7Z030-1FBG676I chip model is designed to provide a high level of performance and scalability for embedded systems and applications. It is capable of delivering high performance in a wide range of applications and is expected to be used in advanced communication systems and intelligent scenarios in the future. The chip model is also designed to be upgradable, allowing it to be used in the era of fully intelligent systems. It is expected to be used in a wide range of applications, including industrial automation, medical, automotive, and consumer electronics.
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4,992 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $402.1693 | $402.1693 |
| 10+ | $397.8449 | $3,978.4489 |
| 100+ | $376.2229 | $37,622.2887 |
| 1000+ | $354.6009 | $177,300.4410 |
| 10000+ | $324.3301 | $324,330.0750 |
| The price is for reference only, please refer to the actual quotation! | ||