XC7Z007S-1CLG400C
XC7Z007S-1CLG400C
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rohs

AMD Xilinx

XC7Z007S-1CLG400C


XC7Z007S-1CLG400C
F20-XC7Z007S-1CLG400C
Active
CMOS, LFBGA
LFBGA

XC7Z007S-1CLG400C ECAD Model


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XC7Z007S-1CLG400C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 1 V
uPs/uCs/Peripheral ICs Type SYSTEM ON CHIP
Technology CMOS
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B400
Operating Temperature-Max 85 °C
Number of Terminals 400
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA400,20X20,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Terminal Form BALL
Terminal Pitch 800 µm
Terminal Position BOTTOM
Seated Height-Max 1.6 mm
Width 17 mm
Length 17 mm
Ihs Manufacturer XILINX INC
Package Description LFBGA,
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Date Of Intro 2017-06-07

XC7Z007S-1CLG400C Datasheet Download


XC7Z007S-1CLG400C Overview



The XC7Z007S-1CLG400C chip model is a powerful and versatile integrated circuit with a wide range of applications. This model is a Field Programmable Gate Array (FPGA), which provides high-speed logic, memory, and other functions. It is designed with a low-power architecture and can be used in a wide range of applications, including automotive, industrial, consumer, and medical.


The XC7Z007S-1CLG400C chip model has several advantages over other chip models. It is highly scalable, allowing for a wide range of functionality and performance. It also has a high-speed logic and memory, allowing for faster processing and storage. The chip model is also highly reliable, with a low error rate and high performance.


The demand for the XC7Z007S-1CLG400C chip model is expected to continue to increase in the future, as it is used in a wide range of industries. It is likely to be used in a variety of networks, such as the Internet of Things (IoT), 5G networks, and cloud computing. It is also likely to be used in intelligent scenarios, such as artificial intelligence (AI) and machine learning (ML).


The XC7Z007S-1CLG400C chip model can be used in the development and popularization of future intelligent robots. It can be used to power the robots’ sensors, which can detect their environment and respond accordingly. It can also be used to control the robots’ motors, allowing them to move around and interact with their environment.


In order to use the XC7Z007S-1CLG400C chip model effectively, certain technical talents are needed. These include knowledge of computer programming, circuit design, and digital electronics. It is also important to have a good understanding of the chip model’s architecture and how it works. Additionally, a good understanding of the FPGA’s programming language is needed in order to program the chip model.


Overall, the XC7Z007S-1CLG400C chip model is a powerful and versatile integrated circuit with a wide range of applications. It is expected to continue to be in high demand in the future, as it is used in a variety of networks and intelligent scenarios. It can also be used in the development and popularization of future intelligent robots. In order to use the chip model effectively, certain technical talents are needed.



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Unit Price: $18.0772
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Pricing (USD)

QTY Unit Price Ext Price
1+ $16.8118 $16.8118
10+ $16.6310 $166.3102
100+ $15.7272 $1,572.7164
1000+ $14.8233 $7,411.6520
10000+ $13.5579 $13,557.9000
The price is for reference only, please refer to the actual quotation!

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