AMD Xilinx
XC7VX550T-L2FFG1927E
XC7VX550T-L2FFG1927E ECAD Model
XC7VX550T-L2FFG1927E Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 600 | |
| Number of Outputs | 600 | |
| Number of Logic Cells | 554240 | |
| Number of CLBs | 43300 | |
| Combinatorial Delay of a CLB-Max | 610 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 43300 CLBS | |
| Clock Frequency-Max | 1.818 GHz | |
| Power Supplies | 1,1.8 V | |
| Supply Voltage-Max | 1.03 V | |
| Supply Voltage-Min | 970 mV | |
| JESD-30 Code | S-PBGA-B1927 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Number of Terminals | 1927 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1924,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.65 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-1927 | |
| Pin Count | 1927 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.7.B |
XC7VX550T-L2FFG1927E Datasheet Download
XC7VX550T-L2FFG1927E Overview
The XC7VX550T-L2FFG1927E chip model is designed to help enable the development of advanced communication systems. It is a Field Programmable Gate Array (FPGA) that is capable of being configured for a wide range of applications. It is designed to provide flexibility, allowing for easy reconfiguration and upgrades as the needs of the system evolve.
The XC7VX550T-L2FFG1927E is an FPGA that is well-suited for use in networks and can be used in a variety of intelligent scenarios. It is capable of handling high-speed data transfer, as well as providing support for complex algorithms and functions. This makes it a great choice for applications in the era of fully intelligent systems.
The XC7VX550T-L2FFG1927E chip model is designed to meet specific requirements. It has a large number of logic cells, allowing for a wide range of functions and features. It is also highly configurable, allowing for easy reconfiguration and upgrades. Additionally, it is designed to be reliable and efficient, providing a low power consumption rate.
Case studies of the XC7VX550T-L2FFG1927E chip model have been conducted to demonstrate its capabilities. It has been used for a variety of applications, ranging from automotive systems to medical devices. In addition, it has been tested for reliability, showing that it can provide reliable and consistent performance.
When using the XC7VX550T-L2FFG1927E chip model, it is important to take certain precautions. It is important to ensure that the chip model is properly configured and that the power supply is stable. Additionally, it is important to ensure that the chip model is properly cooled and that the system is properly shielded from electromagnetic interference.
The XC7VX550T-L2FFG1927E chip model is a powerful and versatile FPGA that can be used for a wide range of applications. Its original design intention was to provide flexibility and easy reconfiguration, allowing for future upgrades. It is also well-suited for use in networks and can be used in a variety of intelligent scenarios. It is designed to meet specific requirements, providing reliable and efficient performance. When using the XC7VX550T-L2FFG1927E chip model, it is important to take certain precautions to ensure that it is properly configured and that the system is properly shielded from electromagnetic interference.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||