XC7VX550T-3FF1158E
XC7VX550T-3FF1158E
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rohs

AMD Xilinx

XC7VX550T-3FF1158E


XC7VX550T-3FF1158E
F20-XC7VX550T-3FF1158E
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS
-

XC7VX550T-3FF1158E ECAD Model


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XC7VX550T-3FF1158E Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Number of Inputs 350
Number of Outputs 350
Number of Logic Cells 554240
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.818 GHz
Power Supplies 1,1.8 V
JESD-30 Code S-PBGA-B1156
Qualification Status Not Qualified
JESD-609 Code e0
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1156,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
ECCN Code 3A001.A.7.B
HTS Code 8542.39.00.01

XC7VX550T-3FF1158E Datasheet Download


XC7VX550T-3FF1158E Overview



The XC7VX550T-3FF1158E is a high-end chip model designed by Xilinx, a leading provider of programmable logic devices. It is based on the Virtex-7 family of FPGAs and is specifically designed to meet the needs of high-performance applications. The XC7VX550T-3FF1158E is capable of delivering superior performance, flexibility, and scalability.


The original design intention of the XC7VX550T-3FF1158E was to provide a high-performance solution for advanced communication systems. With its high-speed and low-power consumption, the chip model is ideal for applications such as high-speed networking, wireless communication, and high-speed data processing. The chip model also supports a wide range of I/O interfaces, including PCIe, Gigabit Ethernet, and USB.


In terms of future upgrades, the XC7VX550T-3FF1158E is capable of being upgraded with new features and technologies. It can be used in the era of fully intelligent systems, such as 5G networks, AI-driven networks, and machine learning applications. The chip model is also suitable for use in various intelligent scenarios, such as autonomous vehicles, smart homes, and industrial automation.


The product description of the XC7VX550T-3FF1158E includes its features, such as its high-speed transceivers, its high-performance logic, and its low-power consumption. It also has various I/O interfaces, including PCIe, Gigabit Ethernet, and USB. Furthermore, the chip model is designed to meet the specific design requirements of advanced communication systems.


To ensure the best performance of the chip model, it is important to consider certain factors, such as the power requirements, the thermal environment, and the software design. Additionally, it is important to consider the actual case studies of the XC7VX550T-3FF1158E and to take the necessary precautions when using the chip model.


In conclusion, the XC7VX550T-3FF1158E is an advanced chip model designed for high-performance applications. It is capable of delivering superior performance, flexibility, and scalability and can be used in the era of fully intelligent systems. It is important to consider the product description and specific design requirements of the chip model, as well as actual case studies and precautions.



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