
AMD Xilinx
XC7VX485T-L2FF1157E
XC7VX485T-L2FF1157E ECAD Model
XC7VX485T-L2FF1157E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 600 | |
Number of Outputs | 600 | |
Number of Logic Cells | 485760 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 1.818 GHz | |
Power Supplies | 1,1.8 V | |
Supply Voltage-Max | 1.03 V | |
Supply Voltage-Min | 970 mV | |
JESD-30 Code | S-PBGA-B1156 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Number of Terminals | 1156 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1156,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC7VX485T-L2FF1157E Datasheet Download
XC7VX485T-L2FF1157E Overview
The XC7VX485T-L2FF1157E chip model is a cutting-edge product in the field of semiconductor chip design. It is a high-performance, low-power, and cost-effective solution with a wide range of applications. It is designed to meet the requirements of various industries and is suitable for use in a variety of applications.
The XC7VX485T-L2FF1157E chip model is based on the Xilinx Virtex-7 family of FPGAs. It has a wide range of features, including a high-speed transceiver, a high-performance logic cell array, and a high-speed memory interface. It also supports various high-speed I/O standards, such as PCI Express, USB, and Ethernet. The chip is capable of operating at a maximum frequency of up to 667MHz, making it suitable for high-speed applications.
The XC7VX485T-L2FF1157E chip model is designed to offer high performance and low power consumption. It is designed with a low-power architecture and a power-saving mode, which can reduce power consumption by up to 50%. The chip also supports multiple power domains, which can be used to reduce power consumption in different parts of the chip. This makes it suitable for applications where power efficiency is a priority.
The XC7VX485T-L2FF1157E chip model is becoming increasingly popular in the semiconductor industry due to its high-performance, low-power, and cost-effective features. It is expected to be widely used in a variety of industries, including automotive, industrial, and consumer electronics. In addition, its low-power architecture and multiple power domains make it suitable for use in battery-powered applications.
When it comes to the application environment, the XC7VX485T-L2FF1157E chip model can be used in a wide range of applications. For example, it can be used in applications such as high-speed image processing, high-speed data transmission, and high-speed networking. It is also suitable for use in applications that require high-speed memory access, such as high-performance computing and embedded systems.
In order to ensure the successful implementation of the XC7VX485T-L2FF1157E chip model, it is important to consider the specific design requirements and actual case studies. For example, it is important to consider the power and thermal requirements of the chip, as well as the specific design and implementation of the system. It is also important to consider the various design constraints, such as timing, area, and power constraints, as well as the various design tools and techniques that are available.
The XC7VX485T-L2FF1157E chip model is a cutting-edge product in the field of semiconductor chip design. It is a high-performance, low-power, and cost-effective solution with a wide range of applications. It is expected to be widely used in a variety of industries, and its low-power architecture and multiple power domains make it suitable for use in battery-powered applications. In order to ensure the successful implementation of the chip model, it is important to consider the specific design requirements and actual case studies, as well as the various design tools and techniques that are available.
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2,135 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $6,929.6904 | $6,929.6904 |
10+ | $6,855.1776 | $68,551.7760 |
100+ | $6,482.6136 | $648,261.3600 |
1000+ | $6,110.0496 | $3,055,024.8000 |
10000+ | $5,588.4600 | $5,588,460.0000 |
The price is for reference only, please refer to the actual quotation! |