XC7VX485T-L2FF1157E
XC7VX485T-L2FF1157E
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rohs

AMD Xilinx

XC7VX485T-L2FF1157E


XC7VX485T-L2FF1157E
F20-XC7VX485T-L2FF1157E
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS
BGA

XC7VX485T-L2FF1157E ECAD Model


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XC7VX485T-L2FF1157E Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 600
Number of Outputs 600
Number of Logic Cells 485760
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.818 GHz
Power Supplies 1,1.8 V
Supply Voltage-Max 1.03 V
Supply Voltage-Min 970 mV
JESD-30 Code S-PBGA-B1156
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1156,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC7VX485T-L2FF1157E Datasheet Download


XC7VX485T-L2FF1157E Overview



The XC7VX485T-L2FF1157E chip model is a cutting-edge product in the field of semiconductor chip design. It is a high-performance, low-power, and cost-effective solution with a wide range of applications. It is designed to meet the requirements of various industries and is suitable for use in a variety of applications.


The XC7VX485T-L2FF1157E chip model is based on the Xilinx Virtex-7 family of FPGAs. It has a wide range of features, including a high-speed transceiver, a high-performance logic cell array, and a high-speed memory interface. It also supports various high-speed I/O standards, such as PCI Express, USB, and Ethernet. The chip is capable of operating at a maximum frequency of up to 667MHz, making it suitable for high-speed applications.


The XC7VX485T-L2FF1157E chip model is designed to offer high performance and low power consumption. It is designed with a low-power architecture and a power-saving mode, which can reduce power consumption by up to 50%. The chip also supports multiple power domains, which can be used to reduce power consumption in different parts of the chip. This makes it suitable for applications where power efficiency is a priority.


The XC7VX485T-L2FF1157E chip model is becoming increasingly popular in the semiconductor industry due to its high-performance, low-power, and cost-effective features. It is expected to be widely used in a variety of industries, including automotive, industrial, and consumer electronics. In addition, its low-power architecture and multiple power domains make it suitable for use in battery-powered applications.


When it comes to the application environment, the XC7VX485T-L2FF1157E chip model can be used in a wide range of applications. For example, it can be used in applications such as high-speed image processing, high-speed data transmission, and high-speed networking. It is also suitable for use in applications that require high-speed memory access, such as high-performance computing and embedded systems.


In order to ensure the successful implementation of the XC7VX485T-L2FF1157E chip model, it is important to consider the specific design requirements and actual case studies. For example, it is important to consider the power and thermal requirements of the chip, as well as the specific design and implementation of the system. It is also important to consider the various design constraints, such as timing, area, and power constraints, as well as the various design tools and techniques that are available.


The XC7VX485T-L2FF1157E chip model is a cutting-edge product in the field of semiconductor chip design. It is a high-performance, low-power, and cost-effective solution with a wide range of applications. It is expected to be widely used in a variety of industries, and its low-power architecture and multiple power domains make it suitable for use in battery-powered applications. In order to ensure the successful implementation of the chip model, it is important to consider the specific design requirements and actual case studies, as well as the various design tools and techniques that are available.



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Unit Price: $7,451.28
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $6,929.6904 $6,929.6904
10+ $6,855.1776 $68,551.7760
100+ $6,482.6136 $648,261.3600
1000+ $6,110.0496 $3,055,024.8000
10000+ $5,588.4600 $5,588,460.0000
The price is for reference only, please refer to the actual quotation!

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