AMD Xilinx
XC7VX485T-3FFG1761C
XC7VX485T-3FFG1761C ECAD Model
XC7VX485T-3FFG1761C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 700 | |
| Number of Outputs | 700 | |
| Number of Logic Cells | 485760 | |
| Number of CLBs | 75900 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Organization | 75900 CLBS | |
| Supply Voltage-Max | 1.03 V | |
| Supply Voltage-Min | 970 mV | |
| JESD-30 Code | S-PBGA-B1761 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 1761 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LEAD FREE, FBGA-1767 | |
| Pin Count | 1761 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC7VX485T-3FFG1761C Datasheet Download
XC7VX485T-3FFG1761C Overview
The chip model XC7VX485T-3FFG1761C is a powerful and versatile processor that is suitable for a variety of high-performance digital signal processing, embedded processing and image processing applications. It is designed to be used with the HDL (Hardware Description Language) language, allowing for the rapid development of hardware designs.
The XC7VX485T-3FFG1761C has a number of benefits that make it an attractive option for many applications. It features a high-performance and low-power design, allowing it to provide excellent performance while consuming less energy than other chips. It also features a high-density design, allowing for more complex designs to be implemented in a smaller physical size. Additionally, the XC7VX485T-3FFG1761C is highly configurable and can be tailored to meet the specific needs of each application.
The increasing demand for high-performance and low-power processors is expected to drive the demand for the XC7VX485T-3FFG1761C in the future. As more applications require the use of high-performance processors, the demand for the XC7VX485T-3FFG1761C will only increase. Additionally, the XC7VX485T-3FFG1761C is expected to be used in a variety of network applications, such as wireless communication, cellular networks, and the Internet of Things.
The XC7VX485T-3FFG1761C is also expected to be used in intelligent scenarios in the future. As the demand for intelligent devices increases, the XC7VX485T-3FFG1761C will be used to power a wide range of devices, from autonomous vehicles to smart homes. Additionally, the XC7VX485T-3FFG1761C is expected to be used in the era of fully intelligent systems, such as artificial intelligence, machine learning, and robotics.
In conclusion, the XC7VX485T-3FFG1761C is an ideal choice for a variety of high-performance applications. It features a high-performance and low-power design, allowing it to provide excellent performance while consuming less energy than other chips. Additionally, it is highly configurable and can be tailored to meet the specific needs of each application. The increasing demand for high-performance and low-power processors is expected to drive the demand for the XC7VX485T-3FFG1761C in the future. Additionally, the XC7VX485T-3FFG1761C is expected to be used in networks and intelligent scenarios in the future, and it is expected to be used in the era of fully intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||