
AMD Xilinx
XC7VX485T-3FFG1157C
XC7VX485T-3FFG1157C ECAD Model
XC7VX485T-3FFG1157C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 600 | |
Number of Outputs | 600 | |
Number of Logic Cells | 485760 | |
Number of CLBs | 75900 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Organization | 75900 CLBS | |
Supply Voltage-Max | 1.03 V | |
Supply Voltage-Min | 970 mV | |
JESD-30 Code | S-PBGA-B1157 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 1157 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | LEAD FREE, FBGA-1157 | |
Pin Count | 1157 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC7VX485T-3FFG1157C Datasheet Download
XC7VX485T-3FFG1157C Overview
The XC7VX485T-3FFG1157C chip model is a cutting-edge semiconductor device that has been developed to meet the needs of the modern electronics industry. This model is a high-performance, low-cost, and low-power device that can be used in a wide variety of applications. It is designed to be compatible with the latest technologies and is capable of supporting a variety of communication systems.
The XC7VX485T-3FFG1157C chip model is a powerful device that can be used in a variety of applications. It is designed to be compatible with the latest technologies, including high-speed communication systems and advanced robotics. This chip model is capable of supporting a variety of communication systems, including Wi-Fi, Bluetooth, and LTE. It is also capable of supporting advanced robotics, such as autonomous vehicles and robots.
The XC7VX485T-3FFG1157C chip model is designed to be flexible and can be used in a variety of applications. It is capable of supporting a variety of communication systems and advanced robotics. This chip model can be used to develop and popularize future intelligent robots, as well as to support advanced communication systems.
In order to use the XC7VX485T-3FFG1157C chip model effectively, it is important to understand the industry trends and the future development of related industries. It is also important to understand the original design intention of the chip model and the possibility of future upgrades. In addition, it is important to understand the application environment and the specific technologies that are needed to support the chip model.
The XC7VX485T-3FFG1157C chip model is a versatile device that can be used in a variety of applications. It is designed to be compatible with the latest technologies and can be used to develop and popularize future intelligent robots, as well as to support advanced communication systems. In order to use the XC7VX485T-3FFG1157C chip model effectively, it is important to understand the industry trends and the future development of related industries, as well as the original design intention of the chip model and the possibility of future upgrades. It is also important to understand the application environment and the specific technologies that are needed to support the chip model. With the right knowledge and technical talent, the XC7VX485T-3FFG1157C chip model can be used to its fullest potential.
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2,670 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $8,661.2314 | $8,661.2314 |
10+ | $8,568.0998 | $85,680.9984 |
100+ | $8,102.4422 | $810,244.2240 |
1000+ | $7,636.7846 | $3,818,392.3200 |
10000+ | $6,984.8640 | $6,984,864.0000 |
The price is for reference only, please refer to the actual quotation! |