XC7VX485T-3FF1930E
XC7VX485T-3FF1930E
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rohs

AMD Xilinx

XC7VX485T-3FF1930E


XC7VX485T-3FF1930E
F20-XC7VX485T-3FF1930E
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS
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XC7VX485T-3FF1930E ECAD Model


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XC7VX485T-3FF1930E Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 700
Number of Outputs 700
Number of Logic Cells 485760
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.818 GHz
Power Supplies 1,1.8 V
Supply Voltage-Max 1.03 V
Supply Voltage-Min 970 mV
JESD-30 Code S-PBGA-B1924
Qualification Status Not Qualified
JESD-609 Code e0
Operating Temperature-Max 100 °C
Number of Terminals 1924
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1924,44X44,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC7VX485T-3FF1930E Datasheet Download


XC7VX485T-3FF1930E Overview



The XC7VX485T-3FF1930E chip model is a powerful, state-of-the-art device that offers a wide range of advantages for a variety of industries. It is designed to provide high performance and high reliability for a variety of applications. The chip model is designed with a wide range of features that make it suitable for a variety of applications, including communication systems and other advanced applications.


The XC7VX485T-3FF1930E chip model is designed to offer high performance and reliability, with features such as a high-speed processor, advanced memory, and high-speed I/O. It is also designed to be highly scalable, allowing for future upgrades and modifications as needed. The chip model is also designed to be compatible with a variety of communication systems and other advanced applications.


The XC7VX485T-3FF1930E chip model is designed to meet a variety of design requirements. It is designed to be highly reliable and efficient, with features such as a high-speed processor, advanced memory, and high-speed I/O. It is also designed to be highly scalable, allowing for future upgrades and modifications as needed. The chip model is also designed to be compatible with a variety of communication systems and other advanced applications.


The XC7VX485T-3FF1930E chip model is designed to meet a variety of design requirements. It is designed to be highly reliable and efficient, with features such as a high-speed processor, advanced memory, and high-speed I/O. It is also designed to be highly scalable, allowing for future upgrades and modifications as needed. Additionally, the chip model is designed to be compatible with a variety of communication systems and other advanced applications.


The XC7VX485T-3FF1930E chip model is expected to be in high demand in the future, due to its high performance and reliability. It is also expected to be used in a variety of communication systems and other advanced applications. Additionally, the chip model is designed to be highly scalable, allowing for future upgrades and modifications as needed.


The XC7VX485T-3FF1930E chip model is designed to provide a high level of performance and reliability. It is also designed to be highly scalable, allowing for future upgrades and modifications as needed. Additionally, the chip model is designed to be compatible with a variety of communication systems and other advanced applications.


In order to ensure the proper functioning of the XC7VX485T-3FF1930E chip model, it is important to follow certain design requirements. It is important to ensure that the chip model is properly powered, that the necessary components are installed correctly, and that the chip model is properly connected to the communication system. Additionally, it is important to ensure that the chip model is properly configured in order to ensure optimal performance.


In conclusion, the XC7VX485T-3FF1930E chip model is a powerful, state-of-the-art device that offers a wide range of advantages for a variety of industries. It is designed to provide high performance and high reliability for a variety of applications. The chip model is designed with a wide range of features that make it suitable for a variety of applications, including communication systems and other advanced applications. The chip model is expected to be in high demand in the future, due to its high performance and reliability. Additionally, it is designed to be highly scalable, allowing for future upgrades and modifications as needed. In order to ensure the proper functioning of the XC7VX485T-3FF1930E chip model, it is important to follow certain design requirements.



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