AMD Xilinx
XC7VX485T-1FF1761C
XC7VX485T-1FF1761C ECAD Model
XC7VX485T-1FF1761C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 700 | |
| Number of Outputs | 700 | |
| Number of Logic Cells | 485760 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.818 GHz | |
| Power Supplies | 0.9,1.8 V | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1760 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 1760 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1760,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC7VX485T-1FF1761C Datasheet Download
XC7VX485T-1FF1761C Overview
The XC7VX485T-1FF1761C chip model is a powerful and versatile chip model developed by Xilinx, a leading provider of programmable logic devices. This chip model is designed to provide users with a wide range of features, including high-performance, low-power, and cost-effective solutions. It is suitable for a variety of applications, such as embedded systems, communications, medical, and automotive.
The XC7VX485T-1FF1761C chip model provides a range of advantages that make it an attractive choice for many applications. It is a 28nm FPGA device with a maximum of 8,192 logic cells and a maximum of 1,761 DSP slices. It also features a high-performance, low-power Virtex UltraScale+ FPGA architecture, as well as a wide range of I/O standards, including PCIe Gen3, USB3, and SATA. The chip model also offers a wide range of memory resources, including Block RAM, UltraRAM, and QDRII SRAM.
The XC7VX485T-1FF1761C chip model is expected to see increasing demand in the future, particularly in the areas of communications, medical, and automotive applications. This is due to the chip model's high performance, low power, and cost-effectiveness. In addition, the chip model has the potential to be upgraded in the future, allowing for the integration of new technologies, such as 5G communication systems.
The original design intention of the XC7VX485T-1FF1761C chip model was to provide users with a powerful, low-power, and cost-effective solution for a wide range of applications. The chip model is capable of supporting a variety of I/O standards, memory resources, and advanced communication systems. It is also capable of being upgraded in the future, allowing for the integration of new technologies.
In conclusion, the XC7VX485T-1FF1761C chip model is an attractive option for many applications due to its high performance, low power, and cost-effectiveness. It is expected to see increasing demand in the future, particularly in the areas of communications, medical, and automotive applications. Furthermore, the chip model has the potential to be upgraded in the future, allowing for the integration of new technologies. Therefore, the application environment may require the support of new technologies in the future, depending on the specific technologies needed.
2,003 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $5,100.2874 | $5,100.2874 |
| 10+ | $5,045.4456 | $50,454.4560 |
| 100+ | $4,771.2366 | $477,123.6600 |
| 1000+ | $4,497.0276 | $2,248,513.8000 |
| 10000+ | $4,113.1350 | $4,113,135.0000 |
| The price is for reference only, please refer to the actual quotation! | ||