AMD Xilinx
XC7VX415T-L2FFG1927E
XC7VX415T-L2FFG1927E ECAD Model
XC7VX415T-L2FFG1927E Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 600 | |
| Number of Outputs | 600 | |
| Number of Logic Cells | 412160 | |
| Number of CLBs | 32200 | |
| Combinatorial Delay of a CLB-Max | 610 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 32200 CLBS | |
| Clock Frequency-Max | 1.818 GHz | |
| Power Supplies | 1,1.8 V | |
| Supply Voltage-Max | 1.03 V | |
| Supply Voltage-Min | 970 mV | |
| JESD-30 Code | S-PBGA-B1927 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Number of Terminals | 1927 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1924,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.65 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-1927 | |
| Pin Count | 1927 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.7.B |
XC7VX415T-L2FFG1927E Datasheet Download
XC7VX415T-L2FFG1927E Overview
The XC7VX415T-L2FFG1927E chip model is a high-performance FPGA that is suitable for a wide range of applications, including digital signal processing, embedded processing and image processing. It is designed to be used with the HDL (Hardware Description Language) language, and offers a number of advantages over other FPGA models.
The XC7VX415T-L2FFG1927E chip model is designed with a powerful system architecture that supports multiple clock domains, high-speed memory, and high-speed transceivers. This makes it ideal for applications that require high-performance, such as digital signal processing, embedded processing, and image processing. The chip also supports a variety of I/O standards, including LVDS, PCI Express, and Gigabit Ethernet, allowing for easy integration into existing systems.
In addition to its powerful system architecture, the XC7VX415T-L2FFG1927E chip model also offers a number of other advantages. It is designed with a low-power design, which reduces power consumption and helps to reduce overall system costs. It also offers advanced features such as dynamic partial reconfiguration and fast configuration, which allow for faster system development and improved system performance.
The XC7VX415T-L2FFG1927E chip model is expected to be in high demand in the near future, as its powerful system architecture and advanced features make it an ideal choice for a wide range of applications. It is also a cost-effective solution, as it is designed with a low-power design and supports a variety of I/O standards.
When designing a system with the XC7VX415T-L2FFG1927E chip model, it is important to consider the specific design requirements of the application. It is also important to consider the potential risks associated with the chip model, such as the potential for errors due to incorrect configuration or incorrect wiring.
In conclusion, the XC7VX415T-L2FFG1927E chip model is an ideal choice for a wide range of applications, including digital signal processing, embedded processing, and image processing. It is designed with a powerful system architecture, low-power design, and a variety of I/O standards, making it an attractive solution for many applications. It is expected to be in high demand in the near future, as its powerful system architecture and advanced features make it an ideal choice for a wide range of applications. When designing a system with the XC7VX415T-L2FFG1927E chip model, it is important to consider the specific design requirements of the application and the potential risks associated with the chip model.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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