AMD Xilinx
XC7VX415T-L2FFG1157E
XC7VX415T-L2FFG1157E ECAD Model
XC7VX415T-L2FFG1157E Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 600 | |
| Number of Outputs | 600 | |
| Number of Logic Cells | 412160 | |
| Number of CLBs | 32200 | |
| Combinatorial Delay of a CLB-Max | 610 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 32200 CLBS | |
| Clock Frequency-Max | 1.818 GHz | |
| Power Supplies | 1,1.8 V | |
| Supply Voltage-Max | 1.03 V | |
| Supply Voltage-Min | 970 mV | |
| JESD-30 Code | S-PBGA-B1157 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1157 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-1157 | |
| Pin Count | 1157 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XC7VX415T-L2FFG1157E Datasheet Download
XC7VX415T-L2FFG1157E Overview
The XC7VX415T-L2FFG1157E chip model is a powerful, high-performance digital signal processor designed to meet the needs of a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. With its advanced technology and design, the XC7VX415T-L2FFG1157E chip model is capable of providing the highest performance possible while remaining cost-effective.
The XC7VX415T-L2FFG1157E chip model is designed to meet the needs of a wide range of industries. As technology continues to evolve, the XC7VX415T-L2FFG1157E chip model is designed to keep up with the latest trends. It is capable of supporting new technologies as the industry demands them. This chip model is also designed with the intention of being upgradable, so that it can be applied to advanced communication systems in the future.
The XC7VX415T-L2FFG1157E chip model is designed to be a powerful and reliable processor. It is capable of providing high-performance digital signal processing, embedded processing, and image processing, while remaining cost-effective. With its advanced technology and design, the XC7VX415T-L2FFG1157E chip model is designed to meet the needs of a wide range of industries and applications. It is capable of supporting new technologies as the industry demands them, and is designed with the intention of being upgradable, so that it can be applied to advanced communication systems in the future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||