XC7VX415T-3FFG1158C
XC7VX415T-3FFG1158C
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC7VX415T-3FFG1158C


XC7VX415T-3FFG1158C
F20-XC7VX415T-3FFG1158C
Active
FIELD PROGRAMMABLE GATE ARRAY
-

XC7VX415T-3FFG1158C ECAD Model


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XC7VX415T-3FFG1158C Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
JESD-609 Code e1
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Terminal Finish TIN SILVER COPPER
Ihs Manufacturer XILINX INC
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XC7VX415T-3FFG1158C Datasheet Download


XC7VX415T-3FFG1158C Overview



The XC7VX415T-3FFG1158C is a cutting-edge chip model designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is an ideal choice for engineers who require the use of HDL language for their projects.


The XC7VX415T-3FFG1158C is designed with a flexible architecture that allows for future upgrades. It is capable of supporting advanced communication systems, making it a versatile choice for a wide range of applications.


The XC7VX415T-3FFG1158C is a high-performance chip model that features a wide range of features and capabilities. It is capable of supporting a variety of digital signal processing tasks, as well as embedded processing and image processing. It also supports a variety of HDL languages, making it a versatile choice for engineers.


The XC7VX415T-3FFG1158C is designed to be easy to use and configure. It comes with a comprehensive set of design documents that provide detailed information about the chip model's capabilities and features. Additionally, the chip model is designed to be highly reliable and efficient, making it an ideal choice for engineers looking for reliable performance.


When designing with the XC7VX415T-3FFG1158C, it is important to consider the specific design requirements of the project. This includes the type of digital signal processing tasks that will be performed, as well as the type of embedded processing and image processing tasks that will be performed. Additionally, engineers should consider the type of HDL language that will be used, as well as any potential upgrades that may be required in the future.


Finally, engineers should also consider any potential safety or reliability concerns when using the XC7VX415T-3FFG1158C. This includes ensuring that the chip model is properly configured and that any potential upgrades are done in a safe and reliable manner. Additionally, engineers should also consider any case studies that have been done with the chip model, as these can provide valuable insight into how to best use the chip model in a particular application.



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