XC7VX415T-1FFG1927C
XC7VX415T-1FFG1927C
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC7VX415T-1FFG1927C


XC7VX415T-1FFG1927C
F20-XC7VX415T-1FFG1927C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-1927
FBGA-1927

XC7VX415T-1FFG1927C ECAD Model


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XC7VX415T-1FFG1927C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 600
Number of Outputs 600
Number of Logic Cells 412160
Number of CLBs 32200
Combinatorial Delay of a CLB-Max 740 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 32200 CLBS
Clock Frequency-Max 1.818 GHz
Power Supplies 0.9,1.8 V
Supply Voltage-Max 1.03 V
Supply Voltage-Min 970 mV
JESD-30 Code S-PBGA-B1927
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 245
Number of Terminals 1927
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1924,44X44,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 45 mm
Length 45 mm
Seated Height-Max 3.65 mm
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01
Part Package Code BGA
Package Description FBGA-1927
Pin Count 1927

XC7VX415T-1FFG1927C Datasheet Download


XC7VX415T-1FFG1927C Overview



The XC7VX415T-1FFG1927C is a powerful chip model designed for high-performance digital signal processing, embedded processing and image processing. It is a state-of-the-art chip model that uses a high-level hardware description language (HDL) to provide users with the flexibility to design their own hardware solutions.


The XC7VX415T-1FFG1927C chip model has many advantages. It is a highly integrated solution that can handle complex tasks in a single chip. It is also a highly efficient chip model, with a throughput of up to 12.7 Gbps and a power consumption of only 1.3 W. Furthermore, it is a reliable chip model with a low failure rate, making it an ideal choice for applications that require high levels of reliability.


In terms of future demand trends, the XC7VX415T-1FFG1927C chip model is expected to be increasingly used in a wide range of industries, such as automotive, aerospace, industrial automation, medical and consumer electronics. This is due to its high performance, low power consumption, and reliability.


In terms of product design requirements, the XC7VX415T-1FFG1927C chip model requires the use of HDL language to design the hardware solution. It is important to note that the design of the chip model needs to be carefully planned and implemented in order to ensure that it meets the desired specifications. In addition, it is important to consider the actual environment in which the chip model will be used, as this can have an impact on the design of the chip model.


To provide a better understanding of the XC7VX415T-1FFG1927C chip model, there are a number of case studies that can be used as an example. These case studies provide an insight into how the chip model is used in actual applications, as well as the necessary precautions that need to be taken when designing and implementing the chip model.


In conclusion, the XC7VX415T-1FFG1927C is a powerful chip model that is suitable for a wide range of applications. It is highly integrated, efficient, and reliable, making it an ideal choice for many industries. It is important to note that the design of the chip model needs to be carefully planned and implemented in order to ensure that it meets the desired specifications. In addition, actual case studies can provide an insight into how the chip model is used in actual applications, as well as the necessary precautions that need to be taken when designing and implementing the chip model.



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