AMD Xilinx
XC7VX330T-L2FFG1761E
XC7VX330T-L2FFG1761E ECAD Model
XC7VX330T-L2FFG1761E Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 650 | |
| Number of Outputs | 650 | |
| Number of Logic Cells | 326400 | |
| Number of CLBs | 25500 | |
| Combinatorial Delay of a CLB-Max | 610 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 25500 CLBS | |
| Clock Frequency-Max | 1.818 GHz | |
| Power Supplies | 1,1.8 V | |
| Supply Voltage-Max | 1.03 V | |
| Supply Voltage-Min | 970 mV | |
| JESD-30 Code | S-PBGA-B1761 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1761 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1924,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-1761 | |
| Pin Count | 1761 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC7VX330T-L2FFG1761E Datasheet Download
XC7VX330T-L2FFG1761E Overview
The XC7VX330T-L2FFG1761E chip model is a high-performance programmable logic device that is designed for use in a variety of applications, such as digital signal processing, embedded processing, and image processing. It requires the use of HDL language, which is a hardware description language that allows for a high degree of control over the chip's behavior.
The XC7VX330T-L2FFG1761E chip model is well-suited for the current and future needs of the industry. It is capable of handling a wide range of tasks, from basic digital signal processing to more advanced image processing. Its ability to handle a wide range of tasks makes it a great choice for any industry that needs to process large amounts of data quickly and accurately.
The XC7VX330T-L2FFG1761E chip model is also well-suited for use in networks, as it is capable of handling large amounts of data quickly and accurately. It can be used in a variety of intelligent scenarios, such as machine learning and artificial intelligence. It is also capable of being used in the era of fully intelligent systems, such as autonomous vehicles and drones.
The XC7VX330T-L2FFG1761E chip model is capable of handling a wide range of tasks, making it an ideal choice for any industry that needs to process large amounts of data quickly and accurately. It is also well-suited for use in networks and intelligent scenarios, as well as in the era of fully intelligent systems. To ensure that the chip model is able to meet the needs of the industry, it may require the support of new technologies, such as machine learning and artificial intelligence. As the industry continues to develop, the XC7VX330T-L2FFG1761E chip model will be able to adapt to the changing needs of the industry and continue to provide reliable and efficient performance.
You May Also Be Interested In
5,970 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,398.7557 | $3,398.7557 |
| 10+ | $3,362.2099 | $33,622.0992 |
| 100+ | $3,179.4811 | $317,948.1120 |
| 1000+ | $2,996.7523 | $1,498,376.1600 |
| 10000+ | $2,740.9320 | $2,740,932.0000 |
| The price is for reference only, please refer to the actual quotation! | ||