AMD Xilinx
XC7VX330T-L2FFG1157E
XC7VX330T-L2FFG1157E ECAD Model
XC7VX330T-L2FFG1157E Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 600 | |
| Number of Outputs | 600 | |
| Number of Logic Cells | 326400 | |
| Number of CLBs | 25500 | |
| Combinatorial Delay of a CLB-Max | 610 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 25500 CLBS | |
| Clock Frequency-Max | 1.818 GHz | |
| Power Supplies | 1,1.8 V | |
| Supply Voltage-Max | 1.03 V | |
| Supply Voltage-Min | 970 mV | |
| JESD-30 Code | S-PBGA-B1157 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1157 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1924,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-1157 | |
| Pin Count | 1157 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC7VX330T-L2FFG1157E Datasheet Download
XC7VX330T-L2FFG1157E Overview
The XC7VX330T-L2FFG1157E chip model is a powerful and versatile model that is widely used in many industries. It has a number of advantages that make it a desirable choice for many applications. This model is designed to be robust and reliable, making it suitable for a variety of applications. It is also energy efficient, making it ideal for applications that require low power consumption.
The XC7VX330T-L2FFG1157E chip model is expected to experience increased demand in the coming years. This is due to its versatility and its ability to support a wide range of applications. As new technologies emerge, the demand for this model is likely to increase as it is capable of handling the latest advances in technology.
The original design intention of the XC7VX330T-L2FFG1157E chip model was to provide a reliable and robust platform for a variety of applications. This model is capable of handling a wide range of tasks, from basic data processing to complex calculations. It is also capable of supporting advanced communication systems, making it an ideal choice for those who need to stay connected.
The XC7VX330T-L2FFG1157E chip model is also capable of supporting future upgrades. This means that it can be easily adapted to new technologies and applications, allowing it to remain relevant in the ever-changing world of technology. This chip model is also capable of supporting the development and popularization of future intelligent robots. As robots become increasingly sophisticated, this chip model will be able to keep up with the latest advances and remain a viable choice for those who need a reliable and powerful chip model.
To make full use of the XC7VX330T-L2FFG1157E chip model, certain technical talents are required. This includes knowledge of computer hardware and software, as well as the ability to program the chip model. Those who have experience in programming and developing applications will find this chip model to be an ideal choice. In addition, those who are familiar with the latest advances in technology and robotics will also find this chip model to be an excellent choice.
In conclusion, the XC7VX330T-L2FFG1157E chip model is a powerful and versatile model that is capable of handling a wide range of applications. It is expected to experience increased demand in the coming years due to its versatility and its ability to support a wide range of applications. It is also capable of supporting future upgrades, making it an ideal choice for those who need to stay connected. Finally, this chip model is also capable of supporting the development and popularization of future intelligent robots, making it an ideal choice for those who need a reliable and powerful chip model.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||