XC7VX330T-L2FF1157E
XC7VX330T-L2FF1157E
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rohs

AMD Xilinx

XC7VX330T-L2FF1157E


XC7VX330T-L2FF1157E
F20-XC7VX330T-L2FF1157E
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS
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XC7VX330T-L2FF1157E ECAD Model


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XC7VX330T-L2FF1157E Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Number of Inputs 600
Number of Outputs 600
Number of Logic Cells 326400
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.818 GHz
Power Supplies 1,1.8 V
JESD-30 Code S-PBGA-B1156
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1156,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC7VX330T-L2FF1157E Datasheet Download


XC7VX330T-L2FF1157E Overview



The XC7VX330T-L2FF1157E chip model is a powerful and versatile tool for high-performance digital signal processing, embedded processing, image processing, and other applications. This chip model is designed to be used with the HDL language, making it an ideal choice for those who need a powerful and reliable chip model for their projects.


The XC7VX330T-L2FF1157E chip model is designed to be highly efficient and reliable, allowing for maximum performance in a variety of applications. This chip model is designed to be used in a variety of environments, including industrial, medical, and military applications. It is also designed to be highly scalable, allowing for easy upgrades in the future.


The original design intention of the XC7VX330T-L2FF1157E chip model was to provide a powerful and reliable solution for digital signal processing and embedded processing applications. It is designed to be able to handle a wide range of tasks, including image processing, digital signal processing, and other complex tasks. It is also designed to be highly efficient and reliable, allowing for maximum performance in a variety of applications.


The XC7VX330T-L2FF1157E chip model is also designed to be highly compatible with the latest technologies, including advanced communication systems. This allows for the chip model to be used in a variety of applications, including those that require the support of new technologies. This chip model is also designed to be highly upgradable, allowing for future upgrades to be made easily and quickly.


The XC7VX330T-L2FF1157E chip model is an ideal choice for those who need a powerful and reliable solution for their projects. It is designed to be highly efficient and reliable, allowing for maximum performance in a variety of applications. It is also designed to be highly compatible with the latest technologies, allowing for the chip model to be used in a variety of applications. Finally, it is designed to be highly upgradable, allowing for future upgrades to be made easily and quickly.



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