
AMD Xilinx
XC7VX330T-3FFV1157E
XC7VX330T-3FFV1157E ECAD Model
XC7VX330T-3FFV1157E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1 V | |
Number of CLBs | 25500 | |
Combinatorial Delay of a CLB-Max | 580 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Organization | 25500 CLBS | |
Supply Voltage-Max | 1.03 V | |
Supply Voltage-Min | 970 mV | |
JESD-30 Code | S-PBGA-B1157 | |
JESD-609 Code | e1 | |
Number of Terminals | 1157 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991.D |
XC7VX330T-3FFV1157E Datasheet Download
XC7VX330T-3FFV1157E Overview
The XC7VX330T-3FFV1157E chip model is a cutting-edge technology developed by Xilinx, a leader in programmable logic devices. It is a high-performance, low-power, and highly integrated FPGA that is designed to meet the needs of modern communication systems. The XC7VX330T-3FFV1157E chip model has been developed with the intention of providing a powerful, reliable, and cost-effective solution for today’s networking and communication applications.
The XC7VX330T-3FFV1157E chip model is a highly versatile device that can be used in a variety of applications, including advanced communication systems. It is capable of supporting a wide range of protocols, including Ethernet, Wi-Fi, and Bluetooth. The chip model is also capable of supporting a variety of intelligent scenarios, such as machine learning, artificial intelligence, and autonomous driving. It is also capable of supporting the latest 5G cellular networks, making it an ideal solution for modern communication applications.
The XC7VX330T-3FFV1157E chip model is designed to meet the specific requirements of the customer. It is designed to be highly efficient, low power, and highly integrated. It is also designed to be highly reliable and secure, making it an ideal solution for mission-critical applications. The chip model is also designed to be highly scalable, allowing for future upgrades and expansions.
The XC7VX330T-3FFV1157E chip model has been successfully implemented in a variety of applications. For example, it has been used in autonomous vehicles for navigation and obstacle detection, as well as in medical monitoring systems for patient monitoring and diagnosis. In addition, it has been used in industrial automation systems for process control and monitoring. In each case, the chip model has been able to provide reliable and secure performance, making it an ideal solution for a variety of applications.
When considering the XC7VX330T-3FFV1157E chip model, it is important to keep in mind the specific design requirements and potential applications. It is also important to consider the potential for future upgrades and expansions, as well as the potential for use in fully intelligent systems. By taking all of these factors into consideration, it is possible to determine if the XC7VX330T-3FFV1157E chip model is the right solution for the application.
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1,723 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $932.0843 | $932.0843 |
10+ | $922.0619 | $9,220.6190 |
100+ | $871.9498 | $87,194.9844 |
1000+ | $821.8378 | $410,918.8920 |
10000+ | $751.6809 | $751,680.9000 |
The price is for reference only, please refer to the actual quotation! |