XC7VX330T-3FFV1157E
XC7VX330T-3FFV1157E
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rohs

AMD Xilinx

XC7VX330T-3FFV1157E


XC7VX330T-3FFV1157E
F20-XC7VX330T-3FFV1157E
Active
FIELD PROGRAMMABLE GATE ARRAY, BGA
BGA

XC7VX330T-3FFV1157E ECAD Model


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XC7VX330T-3FFV1157E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1 V
Number of CLBs 25500
Combinatorial Delay of a CLB-Max 580 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Organization 25500 CLBS
Supply Voltage-Max 1.03 V
Supply Voltage-Min 970 mV
JESD-30 Code S-PBGA-B1157
JESD-609 Code e1
Number of Terminals 1157
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer XILINX INC
Package Description BGA,
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code 3A991.D

XC7VX330T-3FFV1157E Datasheet Download


XC7VX330T-3FFV1157E Overview



The XC7VX330T-3FFV1157E chip model is a cutting-edge technology developed by Xilinx, a leader in programmable logic devices. It is a high-performance, low-power, and highly integrated FPGA that is designed to meet the needs of modern communication systems. The XC7VX330T-3FFV1157E chip model has been developed with the intention of providing a powerful, reliable, and cost-effective solution for today’s networking and communication applications.


The XC7VX330T-3FFV1157E chip model is a highly versatile device that can be used in a variety of applications, including advanced communication systems. It is capable of supporting a wide range of protocols, including Ethernet, Wi-Fi, and Bluetooth. The chip model is also capable of supporting a variety of intelligent scenarios, such as machine learning, artificial intelligence, and autonomous driving. It is also capable of supporting the latest 5G cellular networks, making it an ideal solution for modern communication applications.


The XC7VX330T-3FFV1157E chip model is designed to meet the specific requirements of the customer. It is designed to be highly efficient, low power, and highly integrated. It is also designed to be highly reliable and secure, making it an ideal solution for mission-critical applications. The chip model is also designed to be highly scalable, allowing for future upgrades and expansions.


The XC7VX330T-3FFV1157E chip model has been successfully implemented in a variety of applications. For example, it has been used in autonomous vehicles for navigation and obstacle detection, as well as in medical monitoring systems for patient monitoring and diagnosis. In addition, it has been used in industrial automation systems for process control and monitoring. In each case, the chip model has been able to provide reliable and secure performance, making it an ideal solution for a variety of applications.


When considering the XC7VX330T-3FFV1157E chip model, it is important to keep in mind the specific design requirements and potential applications. It is also important to consider the potential for future upgrades and expansions, as well as the potential for use in fully intelligent systems. By taking all of these factors into consideration, it is possible to determine if the XC7VX330T-3FFV1157E chip model is the right solution for the application.



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Unit Price: $1,002.2412
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Pricing (USD)

QTY Unit Price Ext Price
1+ $932.0843 $932.0843
10+ $922.0619 $9,220.6190
100+ $871.9498 $87,194.9844
1000+ $821.8378 $410,918.8920
10000+ $751.6809 $751,680.9000
The price is for reference only, please refer to the actual quotation!

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