
AMD Xilinx
XC7VX330T-3FFG1761I
XC7VX330T-3FFG1761I ECAD Model
XC7VX330T-3FFG1761I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XC7VX330T-3FFG1761I Datasheet Download
XC7VX330T-3FFG1761I Overview
The XC7VX330T-3FFG1761I chip model is a powerful and versatile solution for a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. The chip model is designed to be used with the HDL language, which is a hardware description language used to describe the behavior of digital circuits.
The chip model is the latest in a series of products that have been developed to meet the needs of the industry. It is designed to be used in a wide range of applications, from consumer electronics to industrial automation. The chip model is designed to be highly efficient, providing maximum performance with minimal power consumption.
The XC7VX330T-3FFG1761I chip model is designed to be used in a variety of applications, such as high-performance digital signal processing, embedded processing, and image processing. It is designed to be used in a variety of environments, including automotive, medical, and aerospace applications. The chip model is designed to be highly reliable and robust, with a wide range of features and options.
The product description and design requirements of the XC7VX330T-3FFG1761I chip model are detailed in the product manual. It includes information on the features, specifications, and design requirements of the chip model. The product manual also includes actual case studies and precautions, which can be used to ensure the successful implementation of the chip model in various applications.
In terms of industry trends, the XC7VX330T-3FFG1761I chip model is likely to continue to be used in a variety of applications, as technology advances and new applications are developed. It is also likely to be used in a wide range of new technologies, as the need for more efficient and reliable solutions increases.
Overall, the XC7VX330T-3FFG1761I chip model is a powerful and versatile solution for a variety of applications. It is designed to be used in a variety of environments, with a wide range of features and options. The product manual provides detailed information on the features, specifications, and design requirements of the chip model. The product manual also includes actual case studies and precautions, which can be used to ensure the successful implementation of the chip model in various applications. As technology advances and new applications are developed, the XC7VX330T-3FFG1761I chip model is likely to continue to be used in a variety of applications, and may also be used in a wide range of new technologies.
1,547 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $6,861.8041 | $6,861.8041 |
10+ | $6,788.0213 | $67,880.2128 |
100+ | $6,419.1071 | $641,910.7080 |
1000+ | $6,050.1929 | $3,025,096.4400 |
10000+ | $5,533.7130 | $5,533,713.0000 |
The price is for reference only, please refer to the actual quotation! |