XC7VX330T-3FFG1761C
XC7VX330T-3FFG1761C
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rohs

AMD Xilinx

XC7VX330T-3FFG1761C


XC7VX330T-3FFG1761C
F20-XC7VX330T-3FFG1761C
Active
FIELD PROGRAMMABLE GATE ARRAY
-

XC7VX330T-3FFG1761C ECAD Model


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XC7VX330T-3FFG1761C Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
JESD-609 Code e1
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Ihs Manufacturer XILINX INC
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XC7VX330T-3FFG1761C Datasheet Download


XC7VX330T-3FFG1761C Overview



The XC7VX330T-3FFG1761C chip model is a high-performance, low-power field-programmable gate array (FPGA) solution. It is designed to meet the needs of applications requiring high-speed serial connectivity, high-bandwidth memory and high-performance digital signal processing. The chip model can support up to 7.5 Gbps transceivers, DDR3/DDR4 memory controllers, and up to 528K logic cells, making it an ideal choice for a wide range of applications.


The XC7VX330T-3FFG1761C chip model is expected to be in high demand in the coming years, as the need for high-performance, low-power FPGA solutions increases. The chip model is well suited for use in networks, as it can support high-speed serial connectivity, high-bandwidth memory and high-performance digital signal processing. It is also suitable for use in intelligent scenarios, such as machine learning and artificial intelligence, as it provides the necessary computing power to support these applications.


The XC7VX330T-3FFG1761C chip model can also be used in the development and popularization of future intelligent robots. It can provide the necessary computing power to support the development of robots that are capable of performing complex tasks. To use the chip model effectively, technical talents such as engineers, software developers and roboticists are needed to develop the necessary programming and hardware.


In the era of fully intelligent systems, the XC7VX330T-3FFG1761C chip model can be used to provide the necessary computing power for these systems. It can support high-speed serial connectivity, high-bandwidth memory and high-performance digital signal processing, which are all essential for the development of fully intelligent systems. Technical talents such as software developers, engineers and roboticists are needed to develop the necessary programming and hardware for these systems.


Overall, the XC7VX330T-3FFG1761C chip model is a high-performance, low-power FPGA solution that is well suited for use in networks, intelligent scenarios and the development of future intelligent robots. It is expected to be in high demand in the coming years, as the need for high-performance, low-power FPGA solutions increases. It can also be used in the era of fully intelligent systems, and technical talents such as engineers, software developers and roboticists are needed to use the model effectively.



2,625 In Stock


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Unit Price: $7,378.284
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $6,861.8041 $6,861.8041
10+ $6,788.0213 $67,880.2128
100+ $6,419.1071 $641,910.7080
1000+ $6,050.1929 $3,025,096.4400
10000+ $5,533.7130 $5,533,713.0000
The price is for reference only, please refer to the actual quotation!

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