
AMD Xilinx
XC7VX330T-3FFG1157C
XC7VX330T-3FFG1157C ECAD Model
XC7VX330T-3FFG1157C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XC7VX330T-3FFG1157C Datasheet Download
XC7VX330T-3FFG1157C Overview
XC7VX330T-3FFG1157C is a high-performance integrated circuit (IC) from Xilinx, a leading provider of programmable logic solutions. It is specifically designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. Utilizing the latest in field-programmable gate array (FPGA) technology, XC7VX330T-3FFG1157C is capable of delivering high-performance data processing and computing solutions.
The XC7VX330T-3FFG1157C is a powerful IC that offers a wide range of features and benefits. It is capable of processing data at a rate of up to 330 MHz, with a total logic capacity of up to 11,570 logic cells. The chip also features a low-power design, allowing it to consume less power while still delivering high performance. Furthermore, the XC7VX330T-3FFG1157C is designed to be compatible with a range of HDL languages, making it a versatile IC for a variety of applications.
The XC7VX330T-3FFG1157C is an ideal choice for a variety of applications, such as high-performance digital signal processing, embedded processing, and image processing. Its features and benefits make it well-suited for these types of applications, and its versatility makes it suitable for a wide range of use cases.
The XC7VX330T-3FFG1157C is a powerful IC that offers a wide range of features and benefits. In order to make the most of the chip, it is important to understand its design requirements and the best practices for its use. When designing with the XC7VX330T-3FFG1157C, it is important to consider the chip's specific design requirements, such as the use of HDL languages, the power consumption of the chip, and the logic capacity of the chip. Furthermore, it is important to understand the best practices for using the chip, such as proper routing, timing, and clocking.
The XC7VX330T-3FFG1157C is a powerful IC that offers a wide range of features and benefits. As such, it is expected to see increasing demand for the chip in the coming years. As more organizations and industries become aware of the chip's capabilities, its usage is expected to grow significantly.
In conclusion, XC7VX330T-3FFG1157C is a powerful IC that is well-suited for a variety of applications, such as high-performance digital signal processing, embedded processing, and image processing. It is important to understand the chip's design requirements and best practices for its use in order to make the most of the chip. Furthermore, the chip is expected to see increasing demand in the coming years as more organizations and industries become aware of its capabilities.
3,050 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $932.0843 | $932.0843 |
10+ | $922.0619 | $9,220.6190 |
100+ | $871.9498 | $87,194.9844 |
1000+ | $821.8378 | $410,918.8920 |
10000+ | $751.6809 | $751,680.9000 |
The price is for reference only, please refer to the actual quotation! |