XC7VX330T-2FFV1157I
XC7VX330T-2FFV1157I
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rohs

AMD Xilinx

XC7VX330T-2FFV1157I


XC7VX330T-2FFV1157I
F20-XC7VX330T-2FFV1157I
Active
FIELD PROGRAMMABLE GATE ARRAY, BGA
BGA

XC7VX330T-2FFV1157I ECAD Model


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XC7VX330T-2FFV1157I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1 V
Number of CLBs 25500
Combinatorial Delay of a CLB-Max 610 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Organization 25500 CLBS
Supply Voltage-Max 1.03 V
Supply Voltage-Min 970 mV
JESD-30 Code S-PBGA-B1157
JESD-609 Code e1
Number of Terminals 1157
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer XILINX INC
Package Description BGA,
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code 3A991.D

XC7VX330T-2FFV1157I Datasheet Download


XC7VX330T-2FFV1157I Overview



The XC7VX330T-2FFV1157I chip model is a powerful tool for a wide range of applications, such as high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed with a hardware description language (HDL) to enable the development of complex applications.


The chip model is capable of a wide range of tasks and is suitable for a variety of industries, including communications, consumer electronics, automotive, and industrial applications. It is also capable of processing large amounts of data quickly and efficiently, making it a great choice for applications requiring high performance.


In terms of industry trends, the XC7VX330T-2FFV1157I chip model is well suited to the current trend of increased complexity in application development. As the demands of applications increase, the need for powerful and efficient chips also increases. This chip model is designed to meet these demands and provide a versatile platform for application development.


The product description of the XC7VX330T-2FFV1157I chip model is designed to provide a comprehensive overview of the product and its features. It includes detailed information on the chip's design and capabilities, as well as technical specifications and performance metrics. Additionally, the product description provides an overview of the application environment and the technologies needed to support the chip model.


In terms of actual case studies, the XC7VX330T-2FFV1157I chip model has been used in a variety of applications, such as in the automotive industry for advanced driver assistance systems, in the consumer electronics industry for image processing, and in the communications industry for digital signal processing. These case studies provide valuable insight into the capabilities of the chip model and how it can be used in various applications.


Finally, when using the XC7VX330T-2FFV1157I chip model, there are a few precautions to keep in mind. It is important to ensure that the application environment is properly configured to support the chip model, and that the design is optimized for the chip's capabilities. Additionally, it is important to ensure that all of the necessary technologies are available to support the chip model.


Overall, the XC7VX330T-2FFV1157I chip model is a powerful tool for a wide range of applications. It is designed to be programmed with a hardware description language, making it well suited to the current trend of increased complexity in application development. Additionally, the product description provides a comprehensive overview of the product and its features, and actual case studies provide valuable insight into the capabilities of the chip model and how it can be used in various applications. When using the chip model, it is important to ensure that the application environment is properly configured and that all of the necessary technologies are available to support the chip model.



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