
AMD Xilinx
XC7VX330T-2FFG1761E
XC7VX330T-2FFG1761E ECAD Model
XC7VX330T-2FFG1761E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Terminal Finish | TIN SILVER COPPER | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XC7VX330T-2FFG1761E Datasheet Download
XC7VX330T-2FFG1761E Overview
The XC7VX330T-2FFG1761E chip model is a powerful, versatile and efficient solution for high-performance digital signal processing, embedded processing and image processing. This chip model requires the use of HDL language for programming, which makes it a perfect choice for applications that require a high level of performance and reliability.
The XC7VX330T-2FFG1761E chip model offers a number of advantages over traditional processing solutions. It has a high-speed, low-power architecture which allows it to process data quickly and efficiently. It also has a large number of I/O pins, allowing it to easily connect to a variety of devices. Additionally, it has a wide range of features, including a large number of on-chip peripherals, a wide range of memory options, and a rich set of communication protocols.
The XC7VX330T-2FFG1761E chip model is expected to see increased demand in the future, as the need for high-performance embedded processing solutions grows. The chip model is well-suited for applications such as medical imaging, industrial automation, and automotive systems. Additionally, the need for high-speed, low-power solutions is expected to increase, and the XC7VX330T-2FFG1761E chip model is well-equipped to meet this need.
In terms of the application environment, the XC7VX330T-2FFG1761E chip model may require the support of new technologies, depending on the specific needs of the application. For example, if the application requires high-speed data transmission and processing, then the chip model may need to be supported by a high-speed bus protocol, such as PCIe. Additionally, the chip model may need to be supported by a real-time operating system or other software, in order to ensure that the application runs as efficiently as possible.
Overall, the XC7VX330T-2FFG1761E chip model is a powerful and efficient solution for high-performance digital signal processing, embedded processing, and image processing. Its wide range of features, low-power architecture, and high-speed I/O pins make it well-suited for a variety of applications. Additionally, the chip model is expected to see increased demand in the future, as the need for high-performance embedded processing solutions grows. The application environment may require the support of new technologies, depending on the specific needs of the application.
4,752 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $4,557.6919 | $4,557.6919 |
10+ | $4,508.6845 | $45,086.8448 |
100+ | $4,263.6473 | $426,364.7280 |
1000+ | $4,018.6101 | $2,009,305.0400 |
10000+ | $3,675.5580 | $3,675,558.0000 |
The price is for reference only, please refer to the actual quotation! |