AMD Xilinx
XC7VX330T-1FFG1761C
XC7VX330T-1FFG1761C ECAD Model
XC7VX330T-1FFG1761C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 650 | |
| Number of Outputs | 650 | |
| Number of Logic Cells | 326400 | |
| Number of CLBs | 25500 | |
| Combinatorial Delay of a CLB-Max | 740 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 25500 CLBS | |
| Clock Frequency-Max | 1.818 GHz | |
| Power Supplies | 0.9,1.8 V | |
| Supply Voltage-Max | 1.03 V | |
| Supply Voltage-Min | 970 mV | |
| JESD-30 Code | S-PBGA-B1761 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1761 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1924,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-1761 | |
| Pin Count | 1761 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC7VX330T-1FFG1761C Datasheet Download
XC7VX330T-1FFG1761C Overview
The XC7VX330T-1FFG1761C chip model is a powerful and versatile model that was designed with the intention of providing a comprehensive solution for advanced communication systems. It is capable of providing the necessary processing power for a wide range of applications, ranging from networking to artificial intelligence.
The XC7VX330T-1FFG1761C chip model is capable of being upgraded to meet the demands of the future. It is equipped with a large number of powerful processors, as well as an array of memory and storage options, allowing it to be used in more complex scenarios. It is also capable of being used in the era of fully intelligent systems, as it is able to process large amounts of data quickly and efficiently.
The XC7VX330T-1FFG1761C chip model is also suitable for the development and popularization of future intelligent robots. It is equipped with advanced AI capabilities, allowing it to be used in a wide range of scenarios. Furthermore, it is capable of being used in a variety of environments, such as in industrial, medical, and entertainment settings.
In order to use the XC7VX330T-1FFG1761C chip model effectively, certain technical talents are required. These include knowledge of computer programming, network architecture, and artificial intelligence. Additionally, knowledge of robotics and automation is also necessary in order to make full use of the chip model's capabilities. With the right technical skills, the XC7VX330T-1FFG1761C chip model can be used to create powerful and sophisticated robots and machines.
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4,408 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,175.2402 | $2,175.2402 |
| 10+ | $2,151.8506 | $21,518.5056 |
| 100+ | $2,034.9022 | $203,490.2160 |
| 1000+ | $1,917.9538 | $958,976.8800 |
| 10000+ | $1,754.2260 | $1,754,226.0000 |
| The price is for reference only, please refer to the actual quotation! | ||