
AMD Xilinx
XC7VX330T-1FFG1157E
XC7VX330T-1FFG1157E ECAD Model
XC7VX330T-1FFG1157E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XC7VX330T-1FFG1157E Datasheet Download
XC7VX330T-1FFG1157E Overview
The chip model XC7VX330T-1FFG1157E is a powerful and versatile device with a wide range of potential applications. It is a field programmable gate array (FPGA) manufactured by Xilinx, one of the world's leading semiconductor companies. This FPGA is designed to provide high-performance computing and networking solutions, making it ideal for a variety of applications.
The chip model XC7VX330T-1FFG1157E is a high-performance device with a wide range of features and capabilities. It is capable of delivering up to 330T logic cells and 1 million system gates, making it suitable for a wide range of applications. Furthermore, it is designed to support advanced features such as high-speed transceivers, low-power I/O, and advanced software tools.
In terms of industry trends, the chip model XC7VX330T-1FFG1157E is expected to be increasingly used in a variety of applications, including communications, industrial automation, medical, automotive, and consumer electronics. As the demand for more powerful and reliable devices increases, this chip model is expected to remain in high demand in the foreseeable future.
In terms of future applications, the chip model XC7VX330T-1FFG1157E is expected to be used in a variety of networks and intelligent scenarios. It is likely to be used in advanced networks such as 5G networks and in intelligent systems such as autonomous vehicles and smart homes. Furthermore, it is expected to be used in the era of fully intelligent systems, such as artificial intelligence (AI) and machine learning (ML).
In conclusion, the chip model XC7VX330T-1FFG1157E is a powerful and versatile device with a wide range of potential applications. It is expected to remain in high demand in the foreseeable future, and is likely to be used in a variety of networks and intelligent scenarios. It is expected to be used in the era of fully intelligent systems, such as AI and ML.
3,201 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $3,170.5262 | $3,170.5262 |
10+ | $3,136.4346 | $31,364.3456 |
100+ | $2,965.9762 | $296,597.6160 |
1000+ | $2,795.5178 | $1,397,758.8800 |
10000+ | $2,556.8760 | $2,556,876.0000 |
The price is for reference only, please refer to the actual quotation! |