AMD Xilinx
XC7V585T-L2FFG1761E
XC7V585T-L2FFG1761E ECAD Model
XC7V585T-L2FFG1761E Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 750 | |
| Number of Outputs | 750 | |
| Number of Logic Cells | 582720 | |
| Number of CLBs | 45525 | |
| Combinatorial Delay of a CLB-Max | 610 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 45525 CLBS | |
| Clock Frequency-Max | 1.818 GHz | |
| Power Supplies | 1,1.8 V | |
| Supply Voltage-Max | 1.03 V | |
| Supply Voltage-Min | 970 mV | |
| JESD-30 Code | S-PBGA-B1761 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1761 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1760,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-1761 | |
| Pin Count | 1761 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.7.A |
XC7V585T-L2FFG1761E Datasheet Download
XC7V585T-L2FFG1761E Overview
XC7V585T-L2FFG1761E is a chip model developed by Xilinx, Inc., a leading provider of advanced programmable logic solutions. It is a high-performance, low-power, low-cost, low-latency FPGA that is ideal for a wide range of industrial and consumer applications. This chip model has been designed to meet the needs of today's high-speed networks and other communication systems.
The XC7V585T-L2FFG1761E chip model has several advantages that make it an ideal choice for many applications. It has low power consumption, high performance, and high bandwidth, making it suitable for a wide range of applications. It also has a low latency, which is important for applications that require fast response times. Additionally, the chip model is cost-effective, making it an attractive option for many businesses.
The XC7V585T-L2FFG1761E chip model has been designed with the intention of meeting the needs of today's high-speed networks and other communication systems. It is capable of handling high-speed data transmission and can be used to upgrade existing networks. Additionally, it is suitable for advanced communication systems that require low latency and high performance.
In the future, the XC7V585T-L2FFG1761E chip model is expected to be in high demand due to its low-cost, low-power, and high-performance features. It is likely to be used in a variety of applications, including networks, intelligent systems, and other communication systems. Additionally, it is likely to be used in the era of fully intelligent systems, as its low latency, high performance, and low cost make it an ideal choice for such systems.
The XC7V585T-L2FFG1761E chip model is a versatile, cost-effective solution for a wide range of applications. It has been designed with the intention of meeting the needs of today's high-speed networks and other communication systems. Its low power consumption, high performance, and high bandwidth make it an attractive option for many businesses. Additionally, it is likely to be in high demand in the future due to its low cost, low power, and high performance features. It is suitable for advanced communication systems and is likely to be used in the era of fully intelligent systems.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||