AMD Xilinx
XC7V585T-L2FFG1157E
XC7V585T-L2FFG1157E ECAD Model
XC7V585T-L2FFG1157E Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 600 | |
| Number of Outputs | 600 | |
| Number of Logic Cells | 582720 | |
| Number of CLBs | 45525 | |
| Combinatorial Delay of a CLB-Max | 610 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 45525 CLBS | |
| Clock Frequency-Max | 1.818 GHz | |
| Power Supplies | 1,1.8 V | |
| Supply Voltage-Max | 1.03 V | |
| Supply Voltage-Min | 970 mV | |
| JESD-30 Code | S-PBGA-B1157 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1157 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-1157 | |
| Pin Count | 1157 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC7V585T-L2FFG1157E Datasheet Download
XC7V585T-L2FFG1157E Overview
The XC7V585T-L2FFG1157E chip model is a powerful device designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is capable of handling complex tasks that require the use of HDL language. This chip model is an important part of the industry trend and is likely to be used in the development of future intelligent robots.
The chip model XC7V585T-L2FFG1157E provides a wide range of features and capabilities, allowing users to build sophisticated systems with ease. It includes a variety of peripherals and interfaces, allowing for easy integration with other components. The chip model is also capable of supporting new technologies, allowing users to take advantage of the latest advancements in the field.
In order to use the XC7V585T-L2FFG1157E chip model effectively, certain technical talents are needed. These include knowledge of HDL language, as well as familiarity with the chip model’s capabilities and features. Additionally, knowledge of the application environment, as well as any new technologies that may be needed, is also essential.
The XC7V585T-L2FFG1157E chip model is an important part of the industry trend and is likely to be used in the development and popularization of future intelligent robots. With its powerful capabilities, it can be used to build sophisticated systems with ease. However, in order to use the chip model effectively, certain technical talents are needed, as well as knowledge of the application environment and any new technologies that may be required.
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5,374 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4,044.8304 | $4,044.8304 |
| 10+ | $4,001.3376 | $40,013.3760 |
| 100+ | $3,783.8736 | $378,387.3600 |
| 1000+ | $3,566.4096 | $1,783,204.8000 |
| 10000+ | $3,261.9600 | $3,261,960.0000 |
| The price is for reference only, please refer to the actual quotation! | ||