AMD Xilinx
XC7V585T-3FFG1761I
XC7V585T-3FFG1761I ECAD Model
XC7V585T-3FFG1761I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Number of CLBs | 91050 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Organization | 91050 CLBS | |
| JESD-30 Code | S-PBGA-B1761 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1761 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LEAD FREE, FBGA-1767 | |
| Pin Count | 1761 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC7V585T-3FFG1761I Datasheet Download
XC7V585T-3FFG1761I Overview
The XC7V585T-3FFG1761I chip model is a cutting-edge technology in the semiconductor industry, and is widely used in a variety of applications. This model is designed to provide high performance and low power consumption, making it an ideal choice for a wide range of applications.
The XC7V585T-3FFG1761I chip model is based on the Xilinx Virtex-7 FPGA family. It features a wide range of features including high-speed transceivers, high-performance memory, advanced signal processing, and advanced system-level integration. The model is designed to provide the highest performance and lowest power consumption for a wide range of applications.
The XC7V585T-3FFG1761I chip model is designed to be used in advanced communication systems. It is capable of providing the necessary bandwidth and latency for high-speed data transmission and processing. It is also capable of providing the necessary security and reliability for mission-critical applications. The model is also designed to be used in the development and popularization of future intelligent robots.
The XC7V585T-3FFG1761I chip model is designed to be easily upgradable, allowing for future upgrades to meet the changing needs of the industry. It is also designed to be used in a wide range of application environments, allowing for the use of new technologies as they become available.
The XC7V585T-3FFG1761I chip model is an ideal choice for engineers and developers looking to take advantage of the latest technology. It requires technical knowledge and skills to use the model effectively, but with the right training and experience, it can be used to create innovative products and services.
The XC7V585T-3FFG1761I chip model is a powerful and versatile tool for the semiconductor industry. It is designed to provide the highest performance and lowest power consumption for a wide range of applications. It is also designed to be easily upgradable, allowing for future upgrades to meet the changing needs of the industry. With the right training and experience, it can be used to create innovative products and services.
You May Also Be Interested In
3,412 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||