AMD Xilinx
XC7V585T-3FFG1157E
XC7V585T-3FFG1157E ECAD Model
XC7V585T-3FFG1157E Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 600 | |
| Number of Outputs | 600 | |
| Number of Logic Cells | 582720 | |
| Number of CLBs | 45525 | |
| Combinatorial Delay of a CLB-Max | 580 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 45525 CLBS | |
| Clock Frequency-Max | 1.818 GHz | |
| Power Supplies | 1,1.8 V | |
| Supply Voltage-Max | 1.03 V | |
| Supply Voltage-Min | 970 mV | |
| JESD-30 Code | S-PBGA-B1157 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1157 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Package Description | FBGA-1157 | |
| Pin Count | 1157 |
XC7V585T-3FFG1157E Datasheet Download
XC7V585T-3FFG1157E Overview
The XC7V585T-3FFG1157E chip model is a highly advanced and powerful system-on-chip (SoC) designed by Xilinx, a leading provider of programmable logic solutions. It is a member of the Virtex-7 family of FPGAs and is designed to meet the needs of the most demanding applications. The chip is capable of providing high-speed data processing, reliable communication, and low power consumption.
The original design intention of the XC7V585T-3FFG1157E chip model is to provide a versatile platform for users to develop their own custom solutions. It features an array of programmable logic blocks, as well as a wide range of peripherals and I/O capabilities. This makes it an ideal choice for a variety of applications, including advanced communication systems.
The XC7V585T-3FFG1157E chip model also has the potential for future upgrades. Its programmable logic blocks can be programmed to perform a variety of tasks, allowing users to customize the chip to meet their specific needs. Additionally, the chip is capable of providing high-speed data processing and reliable communication, making it a great choice for networks and intelligent scenarios.
In addition to its potential for future upgrades, the XC7V585T-3FFG1157E chip model can also be applied to the development and popularization of future intelligent robots. Its array of programmable logic blocks and I/O capabilities make it an ideal choice for robotic applications. However, it is important to note that developing and deploying robots using the XC7V585T-3FFG1157E chip model requires specialized technical knowledge and skills.
Overall, the XC7V585T-3FFG1157E chip model is a powerful and versatile system-on-chip that can be applied to a range of applications. Its original design intention was to provide a platform for users to develop their own custom solutions. Additionally, it has the potential for future upgrades, making it an ideal choice for advanced communication systems, networks, and intelligent scenarios. Finally, it can be used in the development and popularization of future intelligent robots, though specialized technical knowledge and skills are required to use the chip effectively.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||