
AMD Xilinx
XC7V585T-3FF1761E
XC7V585T-3FF1761E ECAD Model
XC7V585T-3FF1761E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Active | |
Number of Inputs | 750 | |
Number of Outputs | 750 | |
Number of Logic Cells | 582720 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 1.818 GHz | |
Power Supplies | 1,1.8 V | |
JESD-30 Code | S-PBGA-B1760 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Number of Terminals | 1760 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1760,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.7.A | |
HTS Code | 8542.39.00.01 |
XC7V585T-3FF1761E Datasheet Download
XC7V585T-3FF1761E Overview
The XC7V585T-3FF1761E chip model is an integrated circuit (IC) developed by Xilinx, a leading provider of programmable logic solutions. This model is designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is suitable for a wide range of applications, such as medical imaging, industrial automation, and aerospace. The XC7V585T-3FF1761E chip model is programmed using the HDL (Hardware Description Language) language.
The XC7V585T-3FF1761E chip model is a powerful and versatile IC that can be used to create complex digital systems. It is composed of two main components: the programmable logic and the embedded processing system. The programmable logic allows for the design of complex digital systems, while the embedded processing system provides the necessary computing power for the system to run. The model also features a high-speed memory interface, a high-speed I/O interface, and a variety of peripherals.
The XC7V585T-3FF1761E chip model can be used to create a variety of systems, from simple embedded systems to complex digital systems. It can be used to develop and popularize future intelligent robots, as it is capable of providing the necessary computing power to run complex algorithms. To use the chip model effectively, one needs to have a good understanding of HDL language, as well as the architecture of the chip model.
When using the XC7V585T-3FF1761E chip model, there are a few precautions to keep in mind. It is important to use the correct version of the HDL language and to make sure that the design meets the chip model's specifications. It is also important to keep in mind the chip model's power consumption and heat dissipation requirements. Additionally, it is important to use appropriate tools to monitor the chip model's performance and to ensure that the design meets the required performance and reliability standards.
Case studies of the XC7V585T-3FF1761E chip model can be found in a variety of industries, including medical imaging, industrial automation, and aerospace. These case studies provide valuable insights into the capabilities of the chip model and how it can be used to develop and popularize future intelligent robots.
In conclusion, the XC7V585T-3FF1761E chip model is a powerful and versatile IC that can be used to create complex digital systems. It is capable of providing the necessary computing power to run complex algorithms and can be used to develop and popularize future intelligent robots. To use the chip model effectively, one needs to have a good understanding of HDL language and the architecture of the chip model, as well as the power consumption and heat dissipation requirements. Additionally, it is important to use appropriate tools to monitor the chip model's performance and to ensure that the design meets the required performance and reliability standards.
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