XC7V585T-3FF1761E
XC7V585T-3FF1761E
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rohs

AMD Xilinx

XC7V585T-3FF1761E


XC7V585T-3FF1761E
F20-XC7V585T-3FF1761E
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS
-

XC7V585T-3FF1761E ECAD Model


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XC7V585T-3FF1761E Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Number of Inputs 750
Number of Outputs 750
Number of Logic Cells 582720
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.818 GHz
Power Supplies 1,1.8 V
JESD-30 Code S-PBGA-B1760
Qualification Status Not Qualified
JESD-609 Code e0
Number of Terminals 1760
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1760,42X42,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
ECCN Code 3A001.A.7.A
HTS Code 8542.39.00.01

XC7V585T-3FF1761E Datasheet Download


XC7V585T-3FF1761E Overview



The XC7V585T-3FF1761E chip model is an integrated circuit (IC) developed by Xilinx, a leading provider of programmable logic solutions. This model is designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is suitable for a wide range of applications, such as medical imaging, industrial automation, and aerospace. The XC7V585T-3FF1761E chip model is programmed using the HDL (Hardware Description Language) language.


The XC7V585T-3FF1761E chip model is a powerful and versatile IC that can be used to create complex digital systems. It is composed of two main components: the programmable logic and the embedded processing system. The programmable logic allows for the design of complex digital systems, while the embedded processing system provides the necessary computing power for the system to run. The model also features a high-speed memory interface, a high-speed I/O interface, and a variety of peripherals.


The XC7V585T-3FF1761E chip model can be used to create a variety of systems, from simple embedded systems to complex digital systems. It can be used to develop and popularize future intelligent robots, as it is capable of providing the necessary computing power to run complex algorithms. To use the chip model effectively, one needs to have a good understanding of HDL language, as well as the architecture of the chip model.


When using the XC7V585T-3FF1761E chip model, there are a few precautions to keep in mind. It is important to use the correct version of the HDL language and to make sure that the design meets the chip model's specifications. It is also important to keep in mind the chip model's power consumption and heat dissipation requirements. Additionally, it is important to use appropriate tools to monitor the chip model's performance and to ensure that the design meets the required performance and reliability standards.


Case studies of the XC7V585T-3FF1761E chip model can be found in a variety of industries, including medical imaging, industrial automation, and aerospace. These case studies provide valuable insights into the capabilities of the chip model and how it can be used to develop and popularize future intelligent robots.


In conclusion, the XC7V585T-3FF1761E chip model is a powerful and versatile IC that can be used to create complex digital systems. It is capable of providing the necessary computing power to run complex algorithms and can be used to develop and popularize future intelligent robots. To use the chip model effectively, one needs to have a good understanding of HDL language and the architecture of the chip model, as well as the power consumption and heat dissipation requirements. Additionally, it is important to use appropriate tools to monitor the chip model's performance and to ensure that the design meets the required performance and reliability standards.



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