XC7V585T-2FFG1157C
XC7V585T-2FFG1157C
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rohs

AMD Xilinx

XC7V585T-2FFG1157C


XC7V585T-2FFG1157C
F20-XC7V585T-2FFG1157C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-1157
FBGA-1157

XC7V585T-2FFG1157C ECAD Model


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XC7V585T-2FFG1157C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 600
Number of Outputs 600
Number of Logic Cells 582720
Number of CLBs 45525
Combinatorial Delay of a CLB-Max 610 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 45525 CLBS
Clock Frequency-Max 1.818 GHz
Power Supplies 1,1.8 V
Supply Voltage-Max 1.03 V
Supply Voltage-Min 970 mV
JESD-30 Code S-PBGA-B1157
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1157
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1156,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-1157
Pin Count 1157
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC7V585T-2FFG1157C Datasheet Download


XC7V585T-2FFG1157C Overview



The XC7V585T-2FFG1157C chip model is a powerful, versatile and reliable solution for high-performance digital signal processing, embedded processing and image processing. This chip model is designed to be used with HDL language, making it ideal for data-intensive applications.


The XC7V585T-2FFG1157C chip model is designed to provide the highest performance and reliability for digital signal processing, embedded processing and image processing. It is built on the latest technology and has a wide range of features, including multiple cores, high-speed memory and advanced communication protocols.


The chip model is designed to be flexible and upgradeable, allowing for future upgrades and enhancements. It has the capability to be used in advanced communication systems, such as 5G networks, and can be used for a variety of other applications.


The industry trends for the XC7V585T-2FFG1157C chip model are constantly evolving. As new technologies emerge, the chip model will need to be adapted to ensure compatibility. This could involve the addition of new features or the integration of new communication protocols.


The original design intention of the XC7V585T-2FFG1157C chip model was to provide the highest performance and reliability for digital signal processing, embedded processing and image processing. The chip model is designed to be flexible and upgradeable, allowing for future upgrades and enhancements. It has the capability to be used in advanced communication systems, such as 5G networks, and can be used for a variety of other applications.


The XC7V585T-2FFG1157C chip model is an ideal solution for high-performance digital signal processing, embedded processing and image processing. It is designed to be used with HDL language, making it ideal for data-intensive applications. The chip model is designed to be flexible and upgradeable, allowing for future upgrades and enhancements. As new technologies emerge, the chip model will need to be adapted to ensure compatibility. This could involve the addition of new features or the integration of new communication protocols. With its powerful, versatile and reliable design, the XC7V585T-2FFG1157C chip model is an ideal solution for a variety of applications.



3,154 In Stock


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Unit Price: $3,479.424
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Pricing (USD)

QTY Unit Price Ext Price
1+ $3,235.8643 $3,235.8643
10+ $3,201.0701 $32,010.7008
100+ $3,027.0989 $302,709.8880
1000+ $2,853.1277 $1,426,563.8400
10000+ $2,609.5680 $2,609,568.0000
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