XC7V2000T-1FHG1761I
XC7V2000T-1FHG1761I
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rohs

AMD Xilinx

XC7V2000T-1FHG1761I


XC7V2000T-1FHG1761I
F20-XC7V2000T-1FHG1761I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-1761
FBGA-1761

XC7V2000T-1FHG1761I ECAD Model


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XC7V2000T-1FHG1761I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 850
Number of Outputs 850
Number of Logic Cells 1954560
Number of CLBs 152700
Combinatorial Delay of a CLB-Max 740 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 152700 CLBS
Clock Frequency-Max 1.818 GHz
Power Supplies 1,1.8 V
Supply Voltage-Max 1.03 V
Supply Voltage-Min 970 mV
JESD-30 Code S-PBGA-B1761
Qualification Status Not Qualified
JESD-609 Code e1
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 1761
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1760,42X42,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 45 mm
Length 45 mm
Seated Height-Max 3.75 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-1761
Pin Count 1761
Reach Compliance Code not_compliant
ECCN Code 3A001.A.7.A
HTS Code 8542.39.00.01

XC7V2000T-1FHG1761I Datasheet Download


XC7V2000T-1FHG1761I Overview



The chip model XC7V2000T-1FHG1761I is a high-performance, low-power field-programmable gate array (FPGA) based on the Virtex-7 2000T platform from Xilinx. It is designed for applications requiring high performance, low power consumption, and high reliability. It is capable of providing up to 2000T logic cells, up to 1.7 million system gates, and up to 1.2 million flip-flops. It also offers up to 1.2 terabits of on-chip memory and up to 1.5 terabits of off-chip memory.


The advantages of the XC7V2000T-1FHG1761I chip model include its high performance, low power consumption, and high reliability. It is suitable for applications such as high-speed signal processing, image processing, and video processing. It is also suitable for high-speed data transmission and storage applications. It is a cost-effective solution for many applications, including those that require a high degree of integration and scalability.


The demand for the XC7V2000T-1FHG1761I chip model is expected to increase in the future, as it is well suited for applications in the communications, medical, automotive, and industrial markets. In particular, its high performance, low power consumption, and high reliability make it a suitable choice for applications requiring high-speed data transmission and storage. Additionally, its scalability and integration capabilities make it a desirable choice for applications that require a high degree of integration.


The original design of the XC7V2000T-1FHG1761I chip model was intended to provide a high-performance, low-power FPGA solution for a variety of applications. It is capable of providing up to 2000T logic cells, up to 1.7 million system gates, and up to 1.2 million flip-flops. Additionally, it offers up to 1.2 terabits of on-chip memory and up to 1.5 terabits of off-chip memory.


The XC7V2000T-1FHG1761I chip model may be upgraded in the future to meet the needs of more advanced communication systems. It is possible to upgrade the chip model by adding additional logic cells and system gates, increasing the on-chip memory and off-chip memory, and improving its scalability and integration capabilities. Additionally, new technologies may be required to support the application environment, such as advanced signal processing algorithms or high-speed data transmission protocols.


In conclusion, the XC7V2000T-1FHG1761I chip model is a high-performance, low-power FPGA solution that is well suited for applications in the communications, medical, automotive, and industrial markets. It is capable of providing up to 2000T logic cells, up to 1.7 million system gates, and up to 1.2 million flip-flops. Additionally, it offers up to 1.2 terabits of on-chip memory and up to 1.5 terabits of off-chip memory. The chip model may be upgraded in the future to meet the needs of more advanced communication systems, and new technologies may be required to support the application environment.



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Unit Price: $18,004.248
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Pricing (USD)

QTY Unit Price Ext Price
1+ $16,743.9506 $16,743.9506
10+ $16,563.9082 $165,639.0816
100+ $15,663.6958 $1,566,369.5760
1000+ $14,763.4834 $7,381,741.6800
10000+ $13,503.1860 $13,503,186.0000
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