
AMD Xilinx
XC7V2000T-1FHG1761I
XC7V2000T-1FHG1761I ECAD Model
XC7V2000T-1FHG1761I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 850 | |
Number of Outputs | 850 | |
Number of Logic Cells | 1954560 | |
Number of CLBs | 152700 | |
Combinatorial Delay of a CLB-Max | 740 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 152700 CLBS | |
Clock Frequency-Max | 1.818 GHz | |
Power Supplies | 1,1.8 V | |
Supply Voltage-Max | 1.03 V | |
Supply Voltage-Min | 970 mV | |
JESD-30 Code | S-PBGA-B1761 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 1761 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1760,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 45 mm | |
Length | 45 mm | |
Seated Height-Max | 3.75 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | FBGA-1761 | |
Pin Count | 1761 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.7.A | |
HTS Code | 8542.39.00.01 |
XC7V2000T-1FHG1761I Datasheet Download
XC7V2000T-1FHG1761I Overview
The chip model XC7V2000T-1FHG1761I is a high-performance, low-power field-programmable gate array (FPGA) based on the Virtex-7 2000T platform from Xilinx. It is designed for applications requiring high performance, low power consumption, and high reliability. It is capable of providing up to 2000T logic cells, up to 1.7 million system gates, and up to 1.2 million flip-flops. It also offers up to 1.2 terabits of on-chip memory and up to 1.5 terabits of off-chip memory.
The advantages of the XC7V2000T-1FHG1761I chip model include its high performance, low power consumption, and high reliability. It is suitable for applications such as high-speed signal processing, image processing, and video processing. It is also suitable for high-speed data transmission and storage applications. It is a cost-effective solution for many applications, including those that require a high degree of integration and scalability.
The demand for the XC7V2000T-1FHG1761I chip model is expected to increase in the future, as it is well suited for applications in the communications, medical, automotive, and industrial markets. In particular, its high performance, low power consumption, and high reliability make it a suitable choice for applications requiring high-speed data transmission and storage. Additionally, its scalability and integration capabilities make it a desirable choice for applications that require a high degree of integration.
The original design of the XC7V2000T-1FHG1761I chip model was intended to provide a high-performance, low-power FPGA solution for a variety of applications. It is capable of providing up to 2000T logic cells, up to 1.7 million system gates, and up to 1.2 million flip-flops. Additionally, it offers up to 1.2 terabits of on-chip memory and up to 1.5 terabits of off-chip memory.
The XC7V2000T-1FHG1761I chip model may be upgraded in the future to meet the needs of more advanced communication systems. It is possible to upgrade the chip model by adding additional logic cells and system gates, increasing the on-chip memory and off-chip memory, and improving its scalability and integration capabilities. Additionally, new technologies may be required to support the application environment, such as advanced signal processing algorithms or high-speed data transmission protocols.
In conclusion, the XC7V2000T-1FHG1761I chip model is a high-performance, low-power FPGA solution that is well suited for applications in the communications, medical, automotive, and industrial markets. It is capable of providing up to 2000T logic cells, up to 1.7 million system gates, and up to 1.2 million flip-flops. Additionally, it offers up to 1.2 terabits of on-chip memory and up to 1.5 terabits of off-chip memory. The chip model may be upgraded in the future to meet the needs of more advanced communication systems, and new technologies may be required to support the application environment.
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Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $16,743.9506 | $16,743.9506 |
10+ | $16,563.9082 | $165,639.0816 |
100+ | $15,663.6958 | $1,566,369.5760 |
1000+ | $14,763.4834 | $7,381,741.6800 |
10000+ | $13,503.1860 | $13,503,186.0000 |
The price is for reference only, please refer to the actual quotation! |