XC7S50-2CSGA324I

The XC7S50-2CSGA324I is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is based on the 7-series architecture and is suitable for a wide range of applications. The XC7S50-2CSGA324I has a total of 50K logic cells, with 2,100Kbits of RAM, and 324 I/O pins. It also has a total of 11,520 logic slices, with each slice containing four 6-input LUTs and 8 flip-flops. The chip also has 4 DSP slices and 4 clock management tiles.

The XC7S50-2CSGA324I operates at a maximum clock frequency of 250 MHz and is capable of operating from a voltage range of 1.2V to 3.3V. It has an internal temperature range of 0 to 85°C and is also rated for industrial temperature range of -40 to 85°C. It has a total power consumption of 6.3W and is available in a 324-pin, 15 x 15mm, Flip-Chip Ball Grid Array (FCBGA) package.

The XC7S50-2CSGA324I is suitable for a wide range of applications, including embedded systems, industrial automation, communication systems, automotive, aerospace, medical systems, and consumer electronics. It is capable of providing high-speed signal processing, memory and I/O interfacing, and can also be used for signal conditioning, data conversion, and image processing. The chip is also equipped with a range of features such as low-power design, low-latency connections, high-speed transceivers, and a range of I/O standards such as PCI Express, USB, Ethernet, and SATA.