XC7S100-1FGGA676Q

The XC7S100-1FGGA676Q chip model is a Field Programmable Gate Array (FPGA) from Xilinx. It is a mid-range FPGA with a speed grade of -1, and is based on the 7-series architecture. It has a total of 100,000 logic cells and 676 I/Os, and is available in a 676-pin Flip-Chip Ball Grid Array (FCBGA) package. It is designed to operate at a maximum temperature of 105°C and can be used in a wide range of applications, from consumer electronics to industrial automation.

The XC7S100-1FGGA676Q chip model offers a wide range of features, including high-speed transceivers, high-performance DSP slices, and up to 1.5 Mbits of internal RAM. It also offers enhanced power efficiency and low power consumption. It supports a wide range of I/O standards, including LVDS, PCI Express, Gigabit Ethernet, and USB.

The XC7S100-1FGGA676Q chip model is designed to be used in a variety of applications, such as industrial automation, video processing, motor control, and communications. It can also be used in consumer electronics, such as digital cameras, gaming consoles, and home automation systems.

In summary, the XC7S100-1FGGA676Q chip model is a mid-range FPGA from Xilinx with 100,000 logic cells and 676 I/Os. It offers a wide range of features and supports various I/O standards. It is designed to be used in a variety of applications, from industrial automation to consumer electronics.