XC7K70T-3FB676E
XC7K70T-3FB676E
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rohs

AMD Xilinx

XC7K70T-3FB676E


XC7K70T-3FB676E
F20-XC7K70T-3FB676E
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS
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XC7K70T-3FB676E ECAD Model


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XC7K70T-3FB676E Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Number of Inputs 185
Number of Outputs 185
Number of Logic Cells 65600
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.818 GHz
Power Supplies 1,1.8,3.3 V
JESD-30 Code S-PBGA-B676
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 676
Package Body Material PLASTIC
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC7K70T-3FB676E Datasheet Download


XC7K70T-3FB676E Overview



The chip model XC7K70T-3FB676E is a high-performance, low-power programmable logic device (PLD) from Xilinx. It is a powerful, high-speed, and low-cost solution for a wide range of applications, including networking, artificial intelligence, and robotics.


The XC7K70T-3FB676E chip model is designed to provide a high-performance, low-power solution for various applications. It is based on the Xilinx 7-series FPGA architecture and integrates a wide range of features, including a high-speed transceiver, a high-performance processor, and a high-performance memory controller. The chip model also features a wide range of I/O capabilities, including USB 3.0, PCIe, and Gigabit Ethernet.


The XC7K70T-3FB676E chip model can be used in a variety of networking and intelligent scenarios. It can be used to create powerful and efficient networks and intelligent systems. For example, the chip model can be used to create a distributed network of sensors and intelligent devices, which can be used to monitor and control various environmental conditions. It can also be used to create intelligent robots, which can be used to perform various tasks autonomously.


The XC7K70T-3FB676E chip model is suitable for use in the era of fully intelligent systems. It can be used to create powerful and efficient systems that are capable of handling complex tasks. For example, the chip model can be used to create intelligent systems that can identify objects, recognize patterns, and make decisions.


In order to use the XC7K70T-3FB676E chip model effectively, it is important to understand the product description and design requirements. It is also important to understand the actual case studies and precautions associated with the chip model. In addition, it is important to have a good understanding of the technical skills required to use the chip model effectively.


In conclusion, the XC7K70T-3FB676E chip model is a powerful and cost-effective solution for a wide range of applications, including networking, artificial intelligence, and robotics. It is suitable for use in the era of fully intelligent systems and can be used to create powerful and efficient networks and intelligent systems. In order to use the chip model effectively, it is important to understand the product description and design requirements, as well as the actual case studies and precautions associated with the chip model. Additionally, it is important to have a good understanding of the technical skills required to use the chip model effectively.



5,500 In Stock


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Unit Price: $302.412
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Pricing (USD)

QTY Unit Price Ext Price
1+ $281.2432 $281.2432
10+ $278.2190 $2,782.1904
100+ $263.0984 $26,309.8440
1000+ $247.9778 $123,988.9200
10000+ $226.8090 $226,809.0000
The price is for reference only, please refer to the actual quotation!

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