
AMD Xilinx
XC7K70T-3FB676E
XC7K70T-3FB676E ECAD Model
XC7K70T-3FB676E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Active | |
Number of Inputs | 185 | |
Number of Outputs | 185 | |
Number of Logic Cells | 65600 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 1.818 GHz | |
Power Supplies | 1,1.8,3.3 V | |
JESD-30 Code | S-PBGA-B676 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC | |
Package Code | BGA | |
Package Equivalence Code | BGA676,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC7K70T-3FB676E Datasheet Download
XC7K70T-3FB676E Overview
The chip model XC7K70T-3FB676E is a high-performance, low-power programmable logic device (PLD) from Xilinx. It is a powerful, high-speed, and low-cost solution for a wide range of applications, including networking, artificial intelligence, and robotics.
The XC7K70T-3FB676E chip model is designed to provide a high-performance, low-power solution for various applications. It is based on the Xilinx 7-series FPGA architecture and integrates a wide range of features, including a high-speed transceiver, a high-performance processor, and a high-performance memory controller. The chip model also features a wide range of I/O capabilities, including USB 3.0, PCIe, and Gigabit Ethernet.
The XC7K70T-3FB676E chip model can be used in a variety of networking and intelligent scenarios. It can be used to create powerful and efficient networks and intelligent systems. For example, the chip model can be used to create a distributed network of sensors and intelligent devices, which can be used to monitor and control various environmental conditions. It can also be used to create intelligent robots, which can be used to perform various tasks autonomously.
The XC7K70T-3FB676E chip model is suitable for use in the era of fully intelligent systems. It can be used to create powerful and efficient systems that are capable of handling complex tasks. For example, the chip model can be used to create intelligent systems that can identify objects, recognize patterns, and make decisions.
In order to use the XC7K70T-3FB676E chip model effectively, it is important to understand the product description and design requirements. It is also important to understand the actual case studies and precautions associated with the chip model. In addition, it is important to have a good understanding of the technical skills required to use the chip model effectively.
In conclusion, the XC7K70T-3FB676E chip model is a powerful and cost-effective solution for a wide range of applications, including networking, artificial intelligence, and robotics. It is suitable for use in the era of fully intelligent systems and can be used to create powerful and efficient networks and intelligent systems. In order to use the chip model effectively, it is important to understand the product description and design requirements, as well as the actual case studies and precautions associated with the chip model. Additionally, it is important to have a good understanding of the technical skills required to use the chip model effectively.
5,500 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $281.2432 | $281.2432 |
10+ | $278.2190 | $2,782.1904 |
100+ | $263.0984 | $26,309.8440 |
1000+ | $247.9778 | $123,988.9200 |
10000+ | $226.8090 | $226,809.0000 |
The price is for reference only, please refer to the actual quotation! |